Assembly Seq. for Intrusive Reflow Soldering for OFP receptacles

Intrusive reflow (also called “pin-in-paste”) is a technique of using conventional through-hole components in a reflow soldering process.

The receptacles are placed into plated-through-holes in the circuit board (solder paste has previously been screen printed on pads adjacent to the holes) and the board is reflowed in the same pass as other SMT components.