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MCP1703T-2502E/MC
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3300 par Std. Mfr. Pkg
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Code HTS:
ECCN:
Informations PCN:
*** Update of FPCN 110997 & 121804 ***Revision History: February 20, 2025: Issued initial notification.June 09, 2026: Issued final notification. Attached the qualification report. Added column Change X(Yes/No) in the pre and post change table. Provided estimated first ship date to be on September 30, 2026.June 17, 2026: Re-issued final notification. Updated the Number of Lots from 3 to 1 for ESD (CDM), ESD (HBM), and Latch-up tests and updated the Sample Size (per Lot) and Total samples for ESD (CDM) from 12 to 15, ESD (HBM) from 12 to 21, and Latch-up from 12 to 6.Product Category: Linear RegulatorsDescription of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP1702, MCP1703 and MCP1703A device families available in various packages.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2026 (date code: 2640)
***UPDATE OF PCN110997***Revision History: February 20, 2025: Issued initial notification.June 09, 2026: Issued final notification. Attached the qualification report. Added column "Change (Yes/No)" in the pre and post change table. Provided estimated first ship date to be on September 30, 2026Product Category: Linear RegulatorsNotification Subject: CCB 7364.011 Final Notice: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP1702, MCP1703 and MCP1703A device families available in various packages.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP1702, MCP1703 and MCP1703A device families available in various packages.Pre and Post Summary Changes: See attched SPCN document for more detailsReason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. Estimated First Ship Date: 30 September 2026 (date code: 2640)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP1702, MCP1703 and MCP1703A device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
