Référence fabricant
5177983-3
80 Position Dual Row 0.8 mm Pitch Vertical Board to Board Stacking Socket
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| Nom du fabricant: | TE Connectivity | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1800 par Tube | ||||||||||
| Code de date: | |||||||||||
TE Connectivity 5177983-3 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Changes: We plan to transfer back existing assembly lines from a TE leased site in Qingdao high tech zone to TE s main campus in Qingdao for Data and Devices business unit. Target transfer schedule to be finished by the end of January 2024.Reason for Changes: To streamline TE's operating efficiencies and align manufacturing resources based on our internal footprint evaluation.
Statut du produit:
Fonctionnalités et applications
The 5177983-3 is a Series of Board to Board surface-mount connectors, designed for parallel board stacking applications using subminiature connectors to meet today’s electronic industry requirements for high density packaging
Product Features:
- Connector Style = Receptacle
- PCB Mounting Orientation = Vertical
- Board-to-Board Stack Height = 5.00 mm, 6.00 mm, 7.00 mm, 8.00 mm
- Gold (8) Contact Plating, Mating Area, Material
- Solder Tail Contact Plating = Tin over Nickel
- Contact Plating, Mating Area, Material = Gold (8)
- Family Name = Free Height
- Contact Base Material = Copper Alloy
- Housing Color = Natural
- Housing Material = Liquid Crystal Polymer (LCP)
- UL Flammability Rating = UL 94V-0
- Housing Material Temperature = High
View the Complete Series of Board to Board Receptacle
Emballages disponibles
Qté d'emballage(s) :
1800 par Tube