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Manufacturer Part #
MCP6007-E/SN
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1 per Bulk
SOIC-8
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
*****FPCN #119552/MULTIPLE CHANGE UPDATE*****.Revision History:November 01, 2025: Issued initial notification. February 17, 2026: Issued final notification. Attached the Qualification Report. Revised the affected parts list to add MCP6499-E/SL and MCP6499T-E/SL catalog part numbers (CPN). Revised the PCN Title and Description of Change to add "MCP6499" device family. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Provided estimated first ship date to be on March 15, 2026.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected MCP6007, MCP6009, MCP6477, MCP6479, MCP6499, MCP6487 and MCP6497 device families available in 8L and 14L SOIC (.150in) packages.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected MCP6007, MCP6009, MCP6477, MCP6479, MCP6487 and MCP6497 device families available in 8L and 14L SOIC (.150in) packages.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material. Estimated Qualification Completion Date: December 2025
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
