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Référence fabricant
MCP6273T-E/CH
SINGLE 2 MHZ OP W/ CS, E TEMP
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23-6 (SOT-26) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2524 | ||||||||||
Microchip MCP6273T-E/CH - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for MCP603T-E/CH, MCP603T-I/CH, MCP6043T-E/CH, MCP6043T-I/CH, MCP6143T-E/CH, MCP6273T-E/CH, MCP6283T-E/CH and MCP6293T-E/CH catalog part numbers (CPN) available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for MCP603T-E/CH, MCP603T-I/CH, MCP6043T-E/CH, MCP6043T-I/CH, MCP6143T-E/CH, MCP6273T-E/CH, MCP6283T-E/CH and MCP6293T-E/CH catalog part numbers (CPN) available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change:The following is the list of modifications:1. Updated ?Package Types?.2. Updated Section 2.0 ?Typical Performance Curves?.3. Updated Figure 4-4.4. Updated Section 6.2 ?Package Drawings?.5. Updated ?Product Identification System?.6. Added ?Product Identification System (Automotive)?.Reason for Change: To improve productivity.Data Sheet Link: https://www.microchip.com/mymicrochip/filehandler.aspx?documentid=051c43c7-ab9e-48a0-bd37-5bf392c814a8
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6273T-E/CH&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--analog--amplifiers--general-purpose/mcp6273t-e-ch-microchip-4000876
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6273T-E/CH&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--analog--amplifiers--general-purpose/mcp6273t-e-ch-microchip-4000876
Microchip MCP6273T-E/CH - Caractéristiques techniques
| Amplifier Type: | General Purpose |
| No of Channels: | 1 |
| Slew Rate-Nom: | 0.9V/µs |
| Input Offset Voltage-Max: | 3mV |
| Gain Bandwidth Product: | 2MHz |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 2V to 6V |
| Common Mode Rejection Ratio: | 85dB |
| Supply Current: | 170µA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 90dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 110dB |
| Phase Margin: | 65° |
| Low Noise: | 20nV/√Hz |
| Output Current: | 25mA |
| Style d'emballage : | SOT-23-6 (SOT-26) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP6273T-E/CH is a Rail-to-Rail Input/Output CMOS Op Amp with wide gain bandwidth product of 2 MHz and a 65° phase margin for the quiescent curret of 170 µA, available in SOT-23-6 surface mount package.
Features:
- Gain Bandwidth Product: 2 MHz (typical)
- Supply Current: IQ = 170 μA (typical)
- Supply Voltage: 2.0V to 6.0V
- Rail-to-Rail Input/Output
- Extended Temperature Range: –40°C to +125°C
- Available in Single, Dual and Quad Packages
- Parts with Chip Select (CS)- Single (MCP6273)
Applications:
- Automotive
- Portable Equipment
- Photodiode Amplifier
- Analog Filters
- Notebooks and PDAs
- Battery Powered Systems
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-6 (SOT-26)
Méthode de montage :
Surface Mount