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Référence fabricant
MCP4362-104E/ST
MCP4362 Series Quad 8-Bit 257 Step SPI 100 kOhm Non Volatile Digital POT-TSSOP14
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :96 par Tube Style d'emballage :TSSOP-14 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP4362-104E/ST - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP4362-104E/ST&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--analog--digital-potentiometers/mcp4362-104e-st-microchip-5049515
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP4362-104E/ST&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--analog--digital-potentiometers/mcp4362-104e-st-microchip-5049515
Microchip MCP4362-104E/ST - Caractéristiques techniques
| No of Positions: | 257 |
| No of Channels: | 4 |
| Interface: | SPI |
| Wiper Storage: | Non-Volatile |
| Resistance: | 100kΩ |
| Tolerance: | ±20% |
| Supply Voltage: | 2.7V to 5.5V |
| Supply Current: | 1mA |
| Operating Temp Range: | -40°C to +125°C |
| Resolution: | 8b |
| Wiper Resistance: | 300Ω |
| Temp Coefficient (ppm/C): | 150ppm/°C |
| Style d'emballage : | TSSOP-14 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP436X devices are non-volatile, 6-bit (257 wiper steps) digital potentiometers that are programmed/reprogrammed through an SPI compatible interface. The MCP436X devices offer a variety of configurations simplifying design while minimizing cost, package size and pin count.
These devices offer WiperLock™ Technology which allows the user unlimited reprogramming and locking of the wiper setting. This is useful for equipment that requires factory trimming or recalibration. The MCP434X family of devices are available with resistor values of 5 K?, 10 K?, 50 k and 100 K?.
Features:
- Quad Resistor Network
- Potentiometer or Rheostat configuration options
- Resistor Network Resolution
- 7-bit: 128 Resistors (129 Steps)
- 8-bit: 256 Resistors (257 Steps)
- RAB Resistances options of:
- 5 kO
- 10 kO
- 50 kO
- 100 kO
- Zero-Scale to Full-Scale Wiper operation
- Low Wiper Resistance: 75O (typical)
- Low Tempco:
- Absolute (Rheostat): 50 ppm typical (0°C to 70°C)
- Ratiometric (Potentiometer): 15 ppm typical
- Non-volatile Memory
- Automatic Recall of Saved Wiper Setting
- WiperLock™ Technology
- SPI serial interface (10 MHz, modes 0,0 & 1,1)
- High-Speed Read/Writes to wiper registers
- Read/Write to Data EEPROM registers
- Serially enabled EEPROM write protect
- Resistor Network Terminal Disconnect Feature via Terminal Control (TCON) Register
- Reset input pin
- Write Protect Feature:
- Hardware Write Protect (WP) Control pin
- Software Write Protect (WP) Configuration bit
- Brown-out reset protection (1.5 V typical)
- Serial Interface Inactive current (2.5 uA typical)
- High-Voltage Tolerant Digital Inputs: Up to 12.5 V
- Supports Split Rail Applications
- Internal weak pull-up on all digital inputs
- Wide Operating Voltage:
- 2.7 V to 5.5 V - Device Characteristics Specified
- 1.8 V to 5.5 V - Device Operation
- Wide Bandwidth (-3 dB) Operation:
- 2 MHz (typical) for 5.0 kO device
- Extended temperature range (-40°C to +125°C)
View the complete product family of MCP436x series Digital Potentiometers
Emballages disponibles
Qté d'emballage(s) :
96 par Tube
Style d'emballage :
TSSOP-14
Méthode de montage :
Surface Mount
