Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Pays sélectionné
Référence fabricant
CL320SG-G
Tèlèchargez les modèles CAD pour ce produit. En savoir plus sur SnapMagic.
3300 par Reel
SOIC-8
Surface Mount
Informations de livraison:
Le pays d’origine (COO) est attribué au moment de l’expédition et ne peut pas être sélectionné lors du processus de commande. Tous les documents indiqueront le COO au moment de l’expédition.
Code HTS:
ECCN:
Informations PCN:
This is an update/location change to FPCN111806. ALAN-23BXFX592 with 2 notice types -FPCN 118837 PCN Update and FPCN 119111 - Notice WithdrawalRevision History:March 26, 2025: Issued initial notification.January 29, 2026: Issued final notification. Added a "Change (Yes/No) column to the Pre and Post Change Summary Table. Updated the affected parts list to remove HV5523K7-G-REL catalog part number. Attached the Qualification Report. Provided estimated first ship date to be on March 1, 2026.Note: The change described in this PCN does not alter Microchip's current regulatory compliance regarding the material content of the applicable product.Please contact your local Microchip sales office with questions or concerns regarding this notification.Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected HV852, HV853, CL320, CL325, CL330, HV277A, HV89001, CL6, CL7, LND01, MD0105, HV892, HV5623, HV5523, MD0100, CL2, CL525, CL520, FP0100, HV816, CL25, MD0101, HV583, HV582, HV5624, and HV5524 device families of 65K technology available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected HV852, HV853, CL320, CL325, CL330, HV277A, HV89001, CL6, CL7, LND01, MD0105, HV892, HV5623, HV5523, MD0100, CL2, CL525, CL520, FP0100, HV816, CL25, MD0101, HV583, HV582, HV5624, and HV5524 device families of 65K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: November 2025
PCN Status:Final NotificationDescription of Change:Qualification of MMT as an additional assembly site for HV9925SG-G, SR037SG-G, SR036SG-G, CL320SG-G, CL7SG-G, SR087SG-G, SR086SG-G, HV809SG-G, CL325SG-G and CL330SG-G catalog part numbers (CPN) available in 8L SOIC (3.90mm) package.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:11 December 2024 (date code: 2450)
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
