Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
APT75GP120J
APT75GP120J Series 1200 V 128 A Chassis Mount Power MOS 7® IGBT - SOT-227
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1 per Tube Package Style:SOT-227 Mounting Method:Chassis Mount | ||||||||||
| Date Code: | |||||||||||
Microchip APT75GP120J - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Initial Release/Please be advised that this is a change to the document only the product has not been changed. Microchip has released a new Document for the 1200 V Power MOS 7® Punch-through IGBT Collector Cut-off Current @ 125°C of devices. If you are using one of these devices please read the documentlocated at 1200 V Power MOS 7® Punch-through IGBT Collector Cut-off Current @ 125°C.1200 V Power MOS 7® Punch-through IGBT Collector Cut-off Current @ 125°CReason for Change:
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.***Issued final notification. Provided estimated first ship date to be on June 29, 2024.
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APT75GP120J&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--discretes--transistors--igbts/apt75gp120j-microchip-4034614
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APT75GP120J&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--discretes--transistors--igbts/apt75gp120j-microchip-4034614
Microchip APT75GP120J - Technical Attributes
| CE Voltage-Max: | 1200V |
| Collector Current @ 25C: | 128A |
| Power Dissipation-Tot: | 543W |
| Gate - Emitter Voltage: | 20V |
| Pulsed Collector Current: | 300A |
| Collector - Emitter Saturation Voltage: | 3.3V |
| Turn-on Delay Time: | 20ns |
| Turn-off Delay Time: | 163ns |
| Qg Gate Charge: | 320nC |
| Leakage Current: | 100nA |
| Input Capacitance: | 7035pF |
| Thermal Resistance: | 0.23°C/W |
| Operating Temp Range: | -55°C to +150°C |
| No of Terminals: | 4 |
| Package Style: | SOT-227 |
| Mounting Method: | Chassis Mount |
Available Packaging
Package Qty:
1 per Tube
Package Style:
SOT-227
Mounting Method:
Chassis Mount