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Référence fabricant
SY87700ALHG
3.3V 32MBPS-175 MBPS CDR
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :250 par Tray Style d'emballage :TQFP-32EP Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip SY87700ALHG - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Wafer Size changed from 8" to 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated Qualification Completion Date: January 2026
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SY87700ALHG&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--logic--timing-solutions--high-bandwidth/sy87700alhg-microchip-2404911
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SY87700ALHG&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--logic--timing-solutions--high-bandwidth/sy87700alhg-microchip-2404911
Microchip SY87700ALHG - Caractéristiques techniques
| Input Voltage-Max: | 4V |
| Temperature Range: | -40°C to +85°C |
| Supply Voltage-Nom: | 3.15V to 3.45V |
| Frequency-Max: | 1.25GHz |
| Style d'emballage : | TQFP-32EP |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The SY87700ALHG is a 3.3 V 1.25 GHz clock recovery and data retiming integrated circuit for data rates from 32 Mbps up to 208 Mbps NRZ. The device is ideally suited for SONET/SDH/ATM applications and other high-speed data transmission systems
Features:
- 3.3 V power supply
- SONET/SDH/ATM compatible
- Two on-chip PLLs:
- Clock generation
- Clock recovery
- Selectable reference frequencies
- Differential PECL high-speed serial I/O
- Line receiver input: no external buffering needed
- Link fault indication
- 100 K ECL-compatible I/O
- Industrial temperature range–40°C to +85°C
Applications:
- SONET/SDH/ATM OC-1 and OC-3
- Fast Ethernet, SMPTE 259
- Proprietary architecture up to 208 Mbps
Emballages disponibles
Qté d'emballage(s) :
250 par Tray
Style d'emballage :
TQFP-32EP
Méthode de montage :
Surface Mount