
Référence fabricant
25LC040A-I/ST
25LC040A Series 4 Kbit (512 x 8) 5.5 V SMT SPI Bus Serial EEPROM - TSSOP-8
Microchip 25LC040A-I/ST - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Impacts to Data Sheet:NoneReason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated First Ship Date:March 17, 2022 (date code: 2212)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Microchip has released a new Product Documents for the 25AA040A/25LC040A 4-Kbit SPI Bus Serial EEPROM Data Sheet of devices. Description of Change:1. Added Product Identification System section for Automotive; Updated DFN, PDIP, SOIC, SOT23, TDFN and TSSOP package drawings; Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client?, respectively; Replaced ?Automotive (E):? designation with ?Extended (E):? designation; Reformatted some sections for better readability.Impacts to Data Sheet: See above detailsReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 06 January 2022
Statut du produit:
Microchip 25LC040A-I/ST - Caractéristiques techniques
Memory Density: | 4kb |
Memory Organization: | 512 x 8 |
Supply Voltage-Nom: | 2.5V to 5.5V |
Clock Frequency-Max: | 10MHz |
Write Cycle Time-Max (tWC): | 5ms |
Style d'emballage : | TSSOP-8 |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
TSSOP-8
Méthode de montage :
Surface Mount