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Manufacturer Part #
PIC24FJ128GB110-I/PT
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119 per Std. Mfr. Pkg
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of 4900F as new die-attach material and G631H as new mold compound material for selected dsPIC33FJ128xx, dsPIC33FJ256xx, dsPIC33FJ32Gxx, dsPIC33FJ64xx, MTR1202xx, PIC18F9xx, PIC24FJ128Gxx, PIC24FJ192Gxx, PIC24FJ256Gxx, PIC24FJ64Gxx, PIC24FJ96Gxx, PIC24HJ128GPxx, PIC24HJ256GPxx, and PIC24HJ64GPxx device families available in 100L TQFP (12x12x1mm) package.Reason for Change:To improve manufacturability by qualifying 4900F as new die-attach material and G631H as new mold compound material.Change Implementation Status:In ProgressEstimated First Ship Date:September 17, 2024 (date code: 2438)
Description of Change:Qualification of 4900F as new die-attach material and G631H as new mold compound material for selected dsPIC33FJ128xx, dsPIC33FJ256xx, dsPIC33FJ32Gxx, dsPIC33FJ64xx, MTR1202xx, PIC18F9xx, PIC24FJ128Gxx, PIC24FJ192Gxx, PIC24FJ256Gxx, PIC24FJ64Gxx, PIC24FJ96Gxx, PIC24HJ128GPxx, PIC24HJ256GPxx, and PIC24HJ64GPxx device families available in 100L TQFP (12x12x1mm) package.Reason for Change:To improve manufacturability by qualifying 4900F as new die-attach material and G631H as new mold compound material.
Final Notice: Qualification of 100L TQFP (12x12x1mm) with 240x240 Lead-Frame Paddle size at ASAC (UDG) assembly site. Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI and ASAC assembly sites.Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.