
Référence fabricant
93LC56B-I/ST
93LC56 Series 2 Kbit (128 x 16) 5.5 V Microwire Compatible Serial EEPROM-TSSOP-8
Microchip 93LC56B-I/ST - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C - 2-Kbit Microwire Compatible Serial EEPROM Data Sheet of devices. If you are using one of these devices please read the document located at 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C - 2-Kbit Microwire Compatible Serial EEPROM Data Sheet.Description of Change:Corrected ?1st Line Marking Codes? table.Reason for Change: To improve Productivity.
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Impacts to Data Sheet:NoneReason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated First Ship Date:March 17, 2022 (date code: 2212)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Statut du produit:
Microchip 93LC56B-I/ST - Caractéristiques techniques
Memory Density: | 2kb |
Memory Organization: | 128 x 16 |
Supply Voltage-Nom: | 2.5V to 5.5V |
Clock Frequency-Max: | 2MHz |
Write Cycle Time-Max (tWC): | 6ms |
Style d'emballage : | TSSOP-8 |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
100 par Std. Mfr. Pkg
Style d'emballage :
TSSOP-8
Méthode de montage :
Surface Mount