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PIC32CM3204GV00064T-E/V2X
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1500 per Reel
TQFP-64
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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PCN Information:
*** Update for PCN 111567 ***Revision History: March 12, 2025: Issued initial notification.February 04, 2026: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on May 07, 2026. Updated the notification subject. Revised affected parts list to add automotive part numbers. Description of Change: Qualification of UMC Fab 8S (U08S) an additional fabrication site for selected ATMPS001D14A, ATSAMD09C1x, ATSAMD09Dxx, ATSAMD10C1x, ATSAMD10D1x, ATSAMD11C14, ATSAMD11D14, ATSAMD20E1x, ATSAMD20G1x, ATSAMD20J1x, ATSAMD21E1x, ATSAMD21G1x, ATSAMD21J1x, ATSAMDA1E1x, ATSAMDA1G1x, ATSAMDA1J1x, ATSAML10D1xx, ATSAML10E1xx, ATSAML11D1xx, ATSAML11E1xx, ATSAML21E1xx, ATSAML21G1xx, ATSAML21J1xx, ATSAML22G1xx, ATSAML22J1xx, ATSAML22N1xx, PD39210, PD69210, PD69220, PD77010, PD77020, PIC32CM1602GV000xx, PIC32CM2532LE000xx, PIC32CM2532LS000xx, PIC32CM3204GV000xx, PIC32CM5164LE000xx, PIC32CM5164LS000xx, PIC32CM2532LE00100, PIC32CM2532LS00100, PIC32CM5164LE00100 and PIC32CM5164LS00100 device families available in various packages.Reason for Change: To improve productivity and on-time delivery performance by qualifying UMC Fab 8S (U08S) as an additional fabrication site.Change Implementation Status: In ProgressEstimated First Ship Date: 07 May 2026 (date code: 2619)
Description of Change:Microchip has released a new Document for the PIC32CM16/32 GV00 Family Silicon Errata and Data Sheet Clarifications of devices.The following changes were made for this revision:? Updated Table 1 to remove an erroneous product reference from the title.Reason for Change: To improve productivity.Date Document Changes Effective: 19 Nov 2025
UPDATE TO Future PCN 116118 and PCN 116159.Revision History: September 22, 2025: Issued final notification.September 23, 2025: Re-issued final notification to correct the Post Change for wire material to be Au and CuPdAu on the Pre and Post Change Summary table.October 01, 2025: Re-issued final notification to correct the Post Change wire material on the Pre and Post Change Summary table and align with the updated Qual Report attachment.Description of Change: Qualification of CuPdAu as an additional wire material for selected ATSAMD20J17, ATSAMC20J15A, ATSAMC20J16A, ATSAMC20J17A, ATSAMC20J18A, ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD20J14, ATSAMD20J15, ATSAMD20J16, ATSAMD20J18, ATSAMD21J15, ATSAMD21J16, ATSAMD21J17, ATSAMD21J18, ATSAMDA1J14B, ATSAMDA1J15B, ATSAMDA1J16B, PIC32CM1602GV00064, PIC32CM2532JH00064, PIC32CM2532JH01064, PIC32CM2532LE00064, PIC32CM2532LS00064, PIC32CM3204GV00064, PIC32CM3204JH00064, PIC32CM5164JH00064, PIC32CM5164JH01064, PIC32CM5164LE00064, PIC32CM5164LS00064 and PIC32CM6408JH00064 device families available in 64L TQFP (10x10x1mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as an additional wire material.
***UPDATE OF PCN116118***Description of Change: Qualification of CuPdAu as an additional wire material for selected ATSAMD20J17, ATSAMC20J15A, ATSAMC20J16A, ATSAMC20J17A, ATSAMC20J18A, ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD20J14, ATSAMD20J15, ATSAMD20J16, ATSAMD20J18, ATSAMD21J15, ATSAMD21J16, ATSAMD21J17, ATSAMD21J18, ATSAMDA1J14B, ATSAMDA1J15B, ATSAMDA1J16B, PIC32CM1602GV00064, PIC32CM2532JH00064, PIC32CM2532JH01064, PIC32CM2532LE00064, PIC32CM2532LS00064, PIC32CM3204GV00064, PIC32CM3204JH00064, PIC32CM5164JH00064, PIC32CM5164JH01064, PIC32CM5164LE00064, PIC32CM5164LS00064 and PIC32CM6408JH00064 device families available in 64L TQFP (10x10x1mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as an additional wire material.Estimated First Ship Date: 13 November 2025 (date code: 2546)
Description of Change: Qualification of CuPdAu as an additional wire material for selected ATSAMD20J17, ATSAMC20J15A, ATSAMC20J16A, ATSAMC20J17A, ATSAMC20J18A, ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD20J14, ATSAMD20J15, ATSAMD20J16, ATSAMD20J18, ATSAMD21J15, ATSAMD21J16, ATSAMD21J17, ATSAMD21J18, ATSAMDA1J14B, ATSAMDA1J15B, ATSAMDA1J16B, PIC32CM1602GV00064, PIC32CM2532JH00064, PIC32CM2532JH01064, PIC32CM2532LE00064, PIC32CM2532LS00064, PIC32CM3204GV00064, PIC32CM3204JH00064, PIC32CM5164JH00064, PIC32CM5164JH01064, PIC32CM5164LE00064, PIC32CM5164LS00064 and PIC32CM6408JH00064 device families available in 64L TQFP (10x10x1mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as an additional wire material.Estimated First Ship Date: 13 November 2025 (date code: 2546)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
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The Microchip PIC32CM GV microcontrollers (MCUs) are low-power 32...
