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Manufacturer Part #
MIC5205YM5-TR
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3000 per Reel
SOT-23-5 (SOT-25)
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
*** Update of FPCN 118290 / Multiple Change Notification ***Revision History: December 24, 2025: Issued initial notification.March 17, 2026: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on April 17, 2026.Description of Change: Qualification of MTAI as an additional assembly site for selected MIC5205, MIC5207 and MIC5219 device families available in 5L SOT-23 package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Estimated First Ship Date: 17 April 2026 (date code: 2616)
Product Category: Linear RegulatorsNotification Subject: CCB 7962 Initial Notice: Qualification of MTAI as an additional assembly site for selected MIC5205, MIC5207 and MIC5219 device families available in 5L SOT-23 package.Description of Change: Qualification of MTAI as an additional assembly site for selected MIC5205, MIC5207 and MIC5219 device families available in 5L SOT-23 package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Estimated Qualification Completion Date: January 2026
*** Update for PCN 116328 ***Revision History: September 30, 2025: Issued initial notice.December 01, 2025: Issued final notification. Attached the Qualification Report. Provided the Estimated First Ship Date to be on December 29, 2025.Description of Change: Qualification of MTAI as an additional final test location and scan and pack site for MIC5205YM5-TX and MIC5205YM5-TR catalog part numbers (CPN) available in 5L SOT-23 package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional final test location and scan and pack site.Estimated First Ship Date: 29 December 2025 (date code: 2601)
Description of Change: Qualification of MTAI as an additional final test location and scan and pack Reason for Change: To improve manufacturability and on time delivery performance by qualifying Reason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional final test location and scan and pack site.Estimated Qualification Completion Date: October 2025
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
***UPDATE OF PCN110834***Description of Change: CCB 7364.004 Final Notice: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected LM4040, LM4041, MIC23158, MIC23159, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC4043, MIC4680, MIC4681, MIC4682, MIC4684, MIC4685, MIC4690, MIC5201, MIC5203, MIC5205, MIC5206, MIC5207, MIC5208, MIC5209, MIC5210, MIC5211, MIC5212, MIC5213, MIC5216, MIC5219, MIC5234, MIC5236, MIC5237, MIC5238, MIC5239, MIC5270, MIC5271, MIC6211, MIC6270, MIC79050, MM5450 and MM5451 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for MIC5207, MIC5209, MM5450, MM5451, MIC38C44, MIC38C45, MIC38C42, MIC38C43, MIC5233, MIC5205, MIC5235, MIC5219, MIC5225, MIC4684, MIC5239, MIC5236, MIC5234,MIC5238, MIC5210, MIC79050, MIC5212, MIC5201, MIC3490, MIC4685, MIC5295, MIC4680, and MIC5237 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of G700 as a new mold compound material for selected Micrel MIC3490, MIC52xx, MIC62xxxM5, SPN020xxxx device families available in 5L SOT-23 package assembled at STAR assembly site.Reason for Change:To improve manufacturability by qualifying G700 mold compound material and DAP surface prep.Change Implementation Status:In ProgressEstimated First Ship Date:November 15, 2022 (date code: 2247)
Part Status:
On Order
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