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Manufacturer Part #
MIC5264-SGYML-TR
MIC5264 Series 3.3 / 1.8 V Dual Output 150 mA SMT μCap LDO Regulator - MLF-10
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Reel Package Style:MLF-10 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MIC5264-SGYML-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
***UPDATE OF PCN111831***Revision History: March 27, 2025: Issued initial notification.October 23, 2025: Issued final notification. Updated affected parts list to add MIC5247-1.5YML-TR catalog part number (CPN). Attached the Qualification Report. Provided estimated first ship date to be on October 25, 2025.Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for selected MIC5247, MIC5255, MIC5232, MIC5259, MIC5256, MIC5253, MIC5265, MIC5159, MIC5252, MIC5249, MIC5264, MIC2202, MIC2203, MIC2204, MIC2213, MIC2214, MIC2215, MIC2210, MIC2211, and MIC2212 device families of 28k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 25 October 2025 (date code: 2543)
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC5247, MIC5255, MIC5232, MIC5259, MIC5256, MIC5253, MIC5265, MIC5159, MIC5252, MIC5249, MIC5264, MIC2202, MIC2203, MIC2204,MIC2213, MIC2214, MIC2215, MIC2210, MIC2211, and MIC2212 device families of 28k technology available in various packages. Pre and Post Summary Changes: See attached for more detailsImpacts to Datasheet: NoneChange Impact: NoneReason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status: In ProgressEstimated Qualification Completion Date: November 2025Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Timetable Summary: See attached document for more detailsRevision History: March 27, 2025: Issued initial notification.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
PCN Status:Final NotificationPCN Type:Manufacturing ChangeMicrochip Parts Affected:Please open one of the files found in the Affected CPNs section.Note: For your convenience Microchip includes identical files in two formats (.pdf and .xls)Description of Change:Implement new plastic reel material supplier for selected MIC2297, MIC5264 and MICRF302 device families available in 10L VDFN (2.5x2.5x0.9mm) package.Pre and Post Change Summary: See attached
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC5264-SGYML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--regulators-reference--linear-regulators/mic5264-sgyml-tr-microchip-3012642
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC5264-SGYML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--regulators-reference--linear-regulators/mic5264-sgyml-tr-microchip-3012642
Microchip MIC5264-SGYML-TR - Technical Attributes
| Input Voltage-Min: | 2.7V |
| Input Voltage-Max: | 5.5V |
| Output Voltage Fixed: | 3.3V/1.8V |
| Dropout Voltage-Max: | 500mV |
| Output Current-Max: | 150mA |
| Package Style: | MLF-10 |
| Mounting Method: | Surface Mount |
Features & Applications
The MIC5264-SGYML TR is a Part of MIC5264 Series 5.5 V 150 mA µCap Dual LDO Regulator available in MLF-10 surface mount package.
It is ideal for any application in portable electronics, including both RF and Digital applications.
Features:
- 2.7V to 5.5V supply voltage
- Low 75μA quiescent current per LDO
- Tiny 2.5mm x 2.5mm MLF® package
- Low Noise – 57μVrms.
- High PSRR – 60dB at 1kHz
- Low dropout voltage – 210mV at 150mA
- Stable with ceramic output capacitors
- Independent enable pins
- Fast transient response
- Active shutdown on both outputs
Applications:
- Cellular Telephones
- PDAs
- GPS Receivers
Available Packaging
Package Qty:
5000 per Reel
Package Style:
MLF-10
Mounting Method:
Surface Mount