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Manufacturer Part #
MIC5381-G4YFT-TR
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5000 per Reel
TMLF-6
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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PCN Information:
*** Update of FPCN 101980 ***Revision History: November 22, 2026: Issued initial notification.February 26, 2026: Issued final notification. Added the "Change (Yes/No)" column to the Pre and Post Change Summary table. Update the affected parts list to remove EOL'd MIC33163YGJ-T5, MIC33163YGJ-TR, MIC33164YGJ-TR, MIC33164YGJ-T5, MIC33263YGK-TR, MIC33263YGK-T5, MIC33264YGK-TR, MIC33264YGK-T5 catalog part numbers. Attached the Qualification Report. Provided estimated first ship date to be on March 30, 2026.Description of Change: Qualification of UNIG as a new assembly site for selected UCS21xx, MIC23xx, MIC24xx, SPN01xx, MIC28xx, MIC33xx, MIC53xx, MIC50xx, MIC94xx, MIC74xx, SPN02xx, MIC44xx, MIC95xx, MIC30xx, and SPN95xx device families available in multiple packages.Reason for Change: To improve manufacturability by qualifying UNIG as the new assembly site.Estimated First Ship Date: 30 March 2026 (date code: 2614)
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change: Qualification of UNIG as a new assembly site for selected UCS21xx, MIC23xx, MIC24xx, SPN01xx, MIC28xx, MIC33xx, MIC53xx, MIC50xx, MIC94xx, MIC74xx, SPN02xx, MIC44xx, MIC95xx, MIC30xx, and SPN95xx device families available in multiple packages.Reason for Change: To improve manufacturability by qualifying UNIG as the new assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
