Référence fabricant
TC7662AEPA
TC7662A Series 3 V to 18 V Charge Pump DC-to-DC Converter - PDIP-8
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :60 par Tube Style d'emballage :PDIP-8 Méthode de montage :Through Hole | ||||||||||
| Code de date: | |||||||||||
Microchip TC7662AEPA - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
Description of Change:Microchip has released a new Datasheet for the TC7662A - Charge Pump DC-to-DC Converter of devices.Updated Section 1.0, Electrical characteristics. Updated Section 6.0, Packaging Information. Updated Product Identification System. Format changes throughout the document.Date Document Changes Effective: 21 May 2025
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Statut du produit:
Microchip TC7662AEPA - Caractéristiques techniques
| Topology: | Charge Pump |
| Input Voltage: | 3V to 18V |
| Output Current-Max: | 40mA |
| Output Type: | Fixed |
| Switching Frequency-Max: | 12kHz |
| Operating Temp Range: | -40°C to +85°C |
| Efficiency: | 97% |
| No. of Outputs: | 1 |
| Storage Temperature Range: | -65°C to +150°C |
| Style d'emballage : | PDIP-8 |
| Méthode de montage : | Through Hole |
Fonctionnalités et applications
The TC7662A is a pin-compatible upgrade to the Industry standard TC7660 charge pump voltage converter. It converts a +3 V to +18 V input to a corresponding –3 V to –18 V output using only two low-cost capacitors, eliminating inductors and their associated cost, size and EMI.
Features:
- Wide Operating Range: 3 V to 18 V
- Increased Output Current (40mA)
- Pin Compatible with ICL7662/SI7661/TC7660/ LTC1044
- No External Diodes Required
- Low Output Impedance @ IL = 20 mA, 40Ω Typ
- No Low-Voltage Terminal Required
- CMOS Construction
- Available in 8-Pin PDIP and 8-Pin CERDIP Packages
Applications:
- Laptop Computers
- Disk Drives
- Process Instrumentation
- μP-based Controllers
Emballages disponibles
Qté d'emballage(s) :
60 par Tube
Style d'emballage :
PDIP-8
Méthode de montage :
Through Hole