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Référence fabricant
MCP2542WFDT-E/SN
CAN Interface IC CAN FD Transceiver SOIC-8 MCP2542
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :3300 par Reel Style d'emballage :SOIC-8 Méthode de montage :Surface Mount |
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| Code de date: | 2336 | ||||||||||
Microchip MCP2542WFDT-E/SN - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
***UPDATE OF PCN118511 (NOTICE TYPE MATERIAL CHANGE) ***Revision History: January 16, 2026: Issued initial notification. January 19, 2026: Re-issued initial notification to update notification subject.Product Category: Interface- Controller Area Network (CAN)Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected MCP2542FD, MCP2542WFD, MCP2544FD, MCP2544WFD, MCP2557FD, MCP2558FD, MCP2561, MCP2561FD, MCP2562 and MCP2562FD device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach to standardize the use of PFAS free material at MTAI assembly site.Estimated Qualification Completion Date: May 2026
Product Category: Interface- Controller Area Network (CAN)Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected MCP2542FD, MCP2542WFD, MCP2544FD, MCP2544WFD, MCP2557FD, MCP2558FD, MCP2561, MCP2561FD, MCP2562 and MCP2562FD device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach to standardize the use of PFAS free material at MTAI assembly site.Estimated Qualification Completion Date: May 2026Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.
PCN Status:Final NotificationDescription of Change:Reason for Change:To improve productivity by implementing top marking changes.Implement top marking change for MCP2542WFD-E/SN and MCP2542WFDT-E/SN available in 8L SOIC (3.90mm) package assembled at MTAI.Reason for Change:To improve productivity by implementing top marking changes.
Statut du produit:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP2542WFDT-E/SN&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--comm-products--can/mcp2542wfdt-e-sn-microchip-7145982
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP2542WFDT-E/SN&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--comm-products--can/mcp2542wfdt-e-sn-microchip-7145982
Microchip MCP2542WFDT-E/SN - Caractéristiques techniques
| Interface: | SPI |
| Supply Voltage-Nom: | 4.5V to 5.5V |
| Operating Temp Range: | -40°C to +150°C |
| Storage Temperature Range: | -55°C to +150°C |
| JunctionTemperature Range: | -40°C to +150°C |
| Interface Type: | SPI |
| No of Pins: | 8 |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount