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Référence fabricant
APT50M38JFLL
500V 88A 0.038Ω N-ch SOT-227
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :10 par Tube Style d'emballage :SOT-227-4 Méthode de montage :Chassis Mount | ||||||||||
| Code de date: | |||||||||||
Microchip APT50M38JFLL - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.***Issued final notification. Provided estimated first ship date to be on June 29, 2024.
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APT50M38JFLL&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--discretes--transistors--mosfets/apt50m38jfll-microchip-2097336
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APT50M38JFLL&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--discretes--transistors--mosfets/apt50m38jfll-microchip-2097336
Microchip APT50M38JFLL - Caractéristiques techniques
| Product Status: | Active |
| Fet Type: | N-Ch |
| No of Channels: | 1 |
| Drain-to-Source Voltage [Vdss]: | 500V |
| Drain-Source On Resistance-Max: | 0.038Ω |
| Rated Power Dissipation: | 694W |
| Qg Gate Charge: | 270nC |
| Gate-Source Voltage-Max [Vgss]: | 30V |
| Drain Current: | 88A |
| Turn-on Delay Time: | 17ns |
| Turn-off Delay Time: | 50ns |
| Rise Time: | 22ns |
| Fall Time: | 4ns |
| Operating Temp Range: | -55°C to +150°C |
| Gate Source Threshold: | 5V |
| Input Capacitance: | 12000pF |
| Series: | POWER MOS 7® |
| Style d'emballage : | SOT-227-4 |
| Méthode de montage : | Chassis Mount |
Emballages disponibles
Qté d'emballage(s) :
10 par Tube
Style d'emballage :
SOT-227-4
Méthode de montage :
Chassis Mount