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Manufacturer Part #
24AA02E48T-E/OT
Download the CAD models for this product. Learn more about SnapMagic.
3000 per Reel
SOT-23-5 (SOT-25)
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Description of Change:Added 4 million E/W cycles for FC devices only; Added Q6B package outline drawing; Minor editorial updates throughout the document.Date Document Changes Effective: 22 Sep 2025
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
***FPCN108989 UPDATE***Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Revision History: November 18, 2024: Issued initial notification.January 27, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated firstship date to be on February 28, 2025.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach materialand CuPdAu as a new wire material
Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach material and CuPdAu as a new wire material
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:August 20, 2024 (date code: 2434)
Microchip has released a new Datasheet for the 2-Kbit I2C Serial EEPROMs with EUI-48 or EUI-64 Node Identity of devices. Notification Status: FinalDescription of Change:Added automotive product offering; Updated SOT-23 package drawings.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 02 Sep 2023
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Microchip has released a new Datasheet for the 24AA02E48/24AA025E48/24AA02E64/24AA025E64 2-Kbit I2C Serial EEPROMs with EUI-48? or EUI-64? Node Identity Data Sheet of devices. Description of Change:Updated SOIC and SOT-23 package drawings; Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client?, respectively; Replaced ?Automotive (E):?designation with ?Extended (E):? designation; Reformatted some sections for better readability.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 20 Sep 2022
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
