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Manufacturer Part #
MAX24288ETK2T
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2700 per Std. Mfr. Pkg | ||||||||||
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Microchip MAX24288ETK2T - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of G700LA as a new mold compound material for selected MAX24x8x device family available in 68L WQFN (8x8x0.8mm) package assembled at ASCL assembly siteImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying G700LA as a new molding compound material.Change Implementation Status:In ProgressEstimated First Ship Date:January 20,2023 (date code: 2303)
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MAX24288ETK2T&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/C170202649
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MAX24288ETK2T&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/C170202649
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Available Packaging
Package Qty:
2700 per Std. Mfr. Pkg