Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
MCP6L91T-E/SN
Download the CAD models for this product. Learn more about SnapMagic.
3300 per Std. Mfr. Pkg
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Product Category: Linear Comparators, Linear Op AmpsDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected MCP601, MCP603, MCP6041, MCP6043, MCP606, MCP608, MCP6141, MCP6143, MCP616, MCP6231, MCP6241, MCP6271, MCP6273, MCP6281, MCP6283, MCP6291, MCP6293, MCP6541, MCP6546, MCP6L1 and MCP6L71 device families available in 8L SOIC (.150in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.Estimated Qualification Completion Date: March 2026
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.