Manufacturer Part #
530102B00150G
TO-218 Package 6.30 C/W Thermal Resistance High Rise Heat Sink with Fins
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| Mfr. Name: | Boyd | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tray | ||||||||||
| Date Code: | 2404 | ||||||||||
Product Specification Section
Boyd 530102B00150G - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
N/A
File
Date
Part Status:
Active
Active
Boyd 530102B00150G - Technical Attributes
Attributes Table
| Thermal Resistance: | 6.3°C/W |
| Material: | Black Anodized |
| Dimension: | H 44.45mm x L 12.45mm x W 44.45mm |
Features & Applications
The 530102B00150G High rise style heat sink features twisted fins and solderable Wave On mounts and device clip.
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.
Specifications:
- Shape: Square
- Length: 1.750" (44.45 mm)
- Width: 0.490" (12.44 mm)
- Height Off Base (Height of Fin): 1.750" (44.45 mm)
- Material:Aluminum
- Material Finish Black Anodized
- Power Dissipation @ Temperature Rise: 4 W @ 30°C
- Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM
- Thermal Resistance @ Natural: 6.3°C/W
Pricing Section
Global Stock:
691
USA:
691
On Order:
0
Factory Lead Time:
16 Weeks
Quantity
Unit Price
1
$2.56
15
$2.51
30
$2.48
100
$2.43
200+
$2.38
Product Variant Information section
Available Packaging
Package Qty:
100 per Tray