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Manufacturer Part #
LR645N8-G
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2000 per Reel
SOT-89 (SC-62)
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for the selected CL8800, CL8801, HV9110, HV9112, HV9113, HV9120, HV9123, HV9901, HV9910, HV9910B, HV9911, HV9921, HV9922, HV9923, HV9930, HV9931, HV9961, LR645, LR745 and LR8 device families of BIC8 800V (6TK, 6SK, 68K, 66K) technology available in various packages.Pre and Post Summary Changes: See attached documentImpacts to Datasheet:NoneChange Impact:NoneReason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status: In ProgressEstimated Qualification Completion Date: November 2025Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Timetable Summary: See attached documentMethod to Identify Change: Traceability CodeRevision History:March 25, 2025: Issued initial notification.
Description of Change: Qualification of GTBF as an additional assembly site for selected CL1N8-G, CL25N8-G, CL2N8-G, FP0100N8-G, HV9921N8-G, HV9922N8-G, HV9923N8-G, LND150N8-G, LR645N8-G, LR745N8-G, LR8N8-G and MD0100N8-G catalog part numbers (CPN) available in 3L SOT-89 package.Reason for Change: To improve productivity by qualifying GTBF as an additional assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of GTBF as an additional assembly site for selected CL1N8-G, CL25N8-G, CL2N8-G, FP0100N8-G, HV9921N8-G, HV9922N8-G, HV9923N8-G, LND150N8-G, LR645N8-G, LR745N8-G, LR8N8-G and MD0100N8-G catalog part numbers (CPN) available in 3L SOT-89 package.Impacts to Data Sheet:Yes. POD (Product Outline Drawing).Reason for Change:To improve productivity by qualifying GTBF as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:November 2023
Final Notice - Additional Fabrication Site: Qualification of an additional fabrication site for certain Supertex devices.Qualification of an additional fabrication site for HT0440, HT0740, HV9110, HV9112, HV9113, HV9120, HV9123, LR645, LR745 and LR8 Supertex device families.Pre Change: Fabricated at SPTX fab site.Post Change: Fabricated at Microchip FAB2 fab site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.