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Manufacturer Part #
TLE4476DATMA1
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2500 per Reel
TO-252-5 (DPAK5)
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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Description:Old:Products are tested on one or two of the below mentioned sites: Infineon Technologies AG, Regensburg, Germany. Infineon Technologies AG, Villach, Austria.Infineon Technologies Dresden GmbH & Co. KG, Dresden, Germany.Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia.New:Products are tested on all of the below mentioned sites: Infineon Technologies AG, Regensburg, Germany AND Infineon Technologies AG, Villach, Austria AND Infineon Technologies Dresden GmbH & Co. KG, Dresden, Germany AND Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia AND Infineon Technologies Manufacturing (Thailand), Samut Prakan, Thailand (BKK).Reason:Capacity expansion of wafer test within Infineon test cluster locations to assure continuity of supply and enable flexible manufacturing.
Detailed change information:DescriptionPROCESS - WAFER PRODUCTION: New wafer diameterPROCESS - WAFER PRODUCTION: Move all or parts of production to a different wafer fab siteTEST FLOW: Move of all or part of electrical wafer test and/or final test to a different test site.Reason/Motivation:Expansion of wafer production and wafer test site to assure continuity of supply and enable flexible manufacturing. The 200 mm wafer manufacturing technology is the ,state of the art? wafer manufacturing technology at Infineon. Therefore, the above mentioned products will be shifted from 150 mm wafer diameter to 200 mm wafer diameter. Intended start of delivery : 2025-12-08Last order date (LOD) : 2025-12-08Last delivery date (LDD) : 2025-12-08
Description:Datasheet update for product TLE4476DReason:Data sheet correction
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.