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Référence fabricant
MCP1824T-3302E/OT
MCP1824 Series 3.3 V 300 mA Low Quiescent Current LDO Regulator-SOT-223-3
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23-5 (SOT-25) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP1824T-3302E/OT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
******FPCN111387 UPDATE/LOCATION CHANGE******Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.**March 10, 2025: Re-issued initial notification to update the Qualification Plan file.**May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx,TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Microchip has released a new Datasheet for the MCP1824/MCP1824S - 300 mA, Low Voltage, Low Quiescent Current LDO Regulator of devices. Notification Status: FinalDescription of Change:• Updated document layout.• Added automotive qualification to Features and examples to Product Identification System.• Updated Absolute Maximum Ratings to better describe the part.• Note 6 (previously found in the table footnote of AC/DC Characteristics Table) was moved to Absolute Maximum Ratings and is now Note 1.• Updated Section 6.0 “Packaging Information”.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: See above details.Date Document Changes Effective: 28 March 2023
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx, TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP1824T-3302E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--voltage-references/mcp1824t-3302e-ot-microchip-4006333
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP1824T-3302E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--voltage-references/mcp1824t-3302e-ot-microchip-4006333
Microchip MCP1824T-3302E/OT - Caractéristiques techniques
| Type: | Low Dropout |
| Quiescent Current: | 300mA |
| Style d'emballage : | SOT-23-5 (SOT-25) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Features:
- 300 mA Output Current Capability
- Input Operating Voltage Range: 2.1 V to 6.0 V
- Adjustable Output Voltage Range: 0.8V to 5.0V
- Standard Fixed Output Voltages: 0.8V, 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
- Other Fixed Output Voltage Options Available Upon Request
- Low Dropout Voltage: 200 mV Typical at 300 mA
- Typical Output Voltage Tolerance: 0.4%
- Stable with 1.0 µF Ceramic Output Capacitor
- Fast Response to Load Transients
- Low Supply Current: 120 µA (typical)
- Low Shutdown Supply Current: 0.1 µA (typical)
- Fixed Delay on Power Good Output
- Short Circuit Current Limiting and Overtemperature Protection
- 5-Lead Plastic SOT-223, SOT-23 Package Options
Applications:
- High-Speed Driver Chipset Power
- Networking Backplane Cards
- Notebook Computers
- Network Interface Cards
- Palmtop Computers
- 2.5V to 1.XV Regulators
View the MCP18 series of Linear Regulators
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-5 (SOT-25)
Méthode de montage :
Surface Mount