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Référence fabricant
LX7219-01ILQ-TR
3V to 5.5V, 6A Constant Frequency Hysteretic Synchronous Buck Regulator with I2C
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Std. Mfr. Pkg | ||||||||||
| Code de date: | |||||||||||
Microchip LX7219-01ILQ-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 111022 ***Revision History: February 21, 2025: Issued initial notification. December 01, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on December 21, 2025. Added column "Change (Yes/No)" in the pre and post change table. Removed the coplanarity test from the qualification report, as this qualification is not applicable for the VQFN package. Description of Change: Qualification of UNIG as an additional assembly site for LX7219-01ILQ-TR, LX7219-02ILQ-TR and LX7220-03ILQ-TR catalog part numbers (CPN) available in 14L VQFN (2x3x1.0mm) package.Reason for Change: To improve on time delivery performance by qualifying UNIG as an additional assembly site. Estimated First Ship Date: 21 December 2025 (date code: 2551)
Description of Change: Qualification of UNIG as an additional assembly site for LX7219-01ILQ-TR, LX7219-02ILQ-TR and LX7220-03ILQ-TR catalog part numbers (CPN) available in 14L VQFN (2x3x1.0mm)package.Reason for Change: To improve on time delivery performance by qualifying UNIG as an additional assembly site. Estimated Qualification Completion Date: May 2025
*** Future PCN 99345 update ***Revision History:July 03, 2023: Issued initial notification.November 15, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 14, 2023.Description of Change:Qualification of ASEM as an additional final test site for LX7219-01ILQ-TR, LX7219-02ILQ-TR, and LX7220-03ILQ-TR catalog part numbers (CPN) available in 14L VQFN (2x3x1.0mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve manufacturability by qualifying ASEM as an additional final test site.Change Implementation Status:In ProgressEstimated First Ship Date:December 14, 2023 (date code: 2350)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Revision History:August 19, 2021: Issued initial notification.October 27, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 26, 2022.Description of Change:Qualification of UAT as an additional Cu Pillar bumping site for selected LX7220 and LX7219 device families available in 14L VQFN (2x3x1.0mm) package and selected Microsemi LX7180A device family available in 12L VQFN (2x2x1.0mm) package.Reason for Change:To improve productivity by qualifying UAT as an additional Cu pillar bumping site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=LX7219-01ILQ-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--comm-products--controllers/lx7219-01ilq-tr-microchip-C215415088
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- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=LX7219-01ILQ-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--comm-products--controllers/lx7219-01ilq-tr-microchip-C215415088
Emballages disponibles
Qté d'emballage(s) :
3000 par Std. Mfr. Pkg