Référence fabricant
KSZ8081RNDCA-TR
10/100 BASE-TX PHYSICAL LAYER TRANSCEIVER
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1000 par Reel Style d'emballage :QFN-24 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 1728 | ||||||||||
Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
CCB 2672.002 and CCB 2672.003 Final Notice:Qualification of ASE as a new assembly site for selected Micrel KSZ8091xx, KSZ8081xx and SPNZ8011xx device families available in 32L VQFN (5X5X0.9mm) and 24L VQFN (4X4X0.9mm) packages using palladium coated copper wire with gold flash (CuPdAu) bond wire.PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of ASE as a new assembly site for selected Micrel KSZ8091xx, KSZ8081xx and SPNZ8011xx device families available in 32L VQFN (5X5X0.9mm) and 24L VQFN (4X4X0.9mm) packages using palladium coated copper wire with gold flash (CuPdAu) bond wire.Pre Change: Assembled at TICP using silver (Ag) bond wire Post Change:Assembled at ASE using palladium coated copper wire with gold flash (CuPdAu) bond wire.Impacts to Data Sheet: None Change Impact:None Reason for Change:To improve manufacturability by qualifying ASE as a new assembly siteChange Implementation Status:In Progress Estimated First Ship Date: April 30, 2020 (date code: 2018)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Final Notice: Qualification of MTAI as an additional assembly site for selected Micrel products available in 24L VQFN (4x4x0.9mm) packagePre Change: Assembled at TICP using Ag bond wire, EN-4900 die attach and G631 mold compound material.Assembled at ASE using Au bond wire, EN-4900 die attach and G631 mold compound material.Post Change:Assembled at TICP using Ag bond wire, EN-4900 die attach and G631 mold compound material.Assembled at ASE using Au bond wire, EN-4900 die attach and G631 mold compound material.Assembled at MTAI using Au bond wire, 3280 die attach material and G700LTD mold compound material.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly sitePlease be advised that after the estimated first ship date customers may receive pre and post change parts
Data Sheet - 10Base-T/100Base-TX PHY with RMII Support Microchip has released a new DeviceDoc for the KSZ8081RNA/RND - 10Base-T/100Base-TX PHY with RMII Support of devices.Description of Change: 1) Section 6.0, Electrical Characteristics: Corrected the CMOS Level Inputs section and added CMOS Level Outputs section in the EC table from KSZ8081MLX (DS00002264B).Reason for Change: To Improve ManufacturabilityPlease be advised that this is a change to the document only the product has not been changed.
CCB 2672.002 and CCB 2672.003 Initial Notice: Qualification of ASE as a new assembly site for selected products of the 110nm wafer technology at DBHU available in 24L VQFN(4X4X0.9mm) and 32L VQFN(5X5X0.9mm) packages using palladium coated copper wire with gold flash (CuPdAu) bond wire. PCN Status: Initial notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of ASE as a new assembly site for selected products of the 110nm wafer technology at DBHU available in 24L VQFN(4X4X0.9mm) and 32L VQFN 5X5X0.9mm) packages using palladium coated copper wire with gold flash (CuPdAu) bond wirePre Change: Assembled at TICP using silver (Ag) bond wire Post Change: Assembled at ASE using palladium coated copper wire with gold flash (CuPdAu) bond wire. Reason for Change: To improve manufacturability by qualifying ASE as new assembly siteChange Implementation Status: In Progress Estimated Qualification Completion Date: November 2018
Microchip has released a new DeviceDoc for the KSZ8081MLX - 10Base-T/100Base-TX PHY of devices.Description of Change: 1) Updated Register 5h, Bits 4:0 to 0_0000 ,Updated Register 7h, Bit 15 to Reserved and RO, Updated Register 18h, Bits 5:0 to RO and 00_0001,Updated Register 1Eh, Bit 3 to RO in Table 42) Added CMOS Level Inputs values and clarified CMOS Level Outputs section in Table 6-1Reason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 27 Feb 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.
SYST-19UYEG888 Microchip has released a new DeviceDoc for the KSZ8081MNX/RNB - 10Base-T/100Base-TX PHY of devices.Description of Change: 1) Updates to the following addresses 4.15, 5.4:0, 7.15, 18.5:0 and 1E.3 for Table 4-2, "Register Description"2) Values for Total Chip Power modified for Table 3-9 and 3-10.Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 24 Jan 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.
Cycle de vie du produit:
-
Conforme ROHS -
Sans plomb
Caractéristiques techniques
| No of Functions / Channels: | 1 |
| Interface Circuit Type: | RMII |
| Supply Voltage-Nom: | 1.8V to 3.3V |
| Style d'emballage : | QFN-24 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1000 par Reel
Style d'emballage :
QFN-24
Méthode de montage :
Surface Mount
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