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Microchip | KSZ8081RNDCA-TR
10/100 BASE-TX PHYSICAL LAYER TRANSCEIVER
Emballages disponibles
Qté d'emballage(s) :
1 000
Style d'emballage :
QFN-24
Méthode de montage :
Surface Mount
Cycle de vie du produit
Code de date
Informations PCN
Final Notice: Qualification of MTAI as an additional assembly site for selected Micrel products available in 24L VQFN (4x4x0.9mm) packagePre Change: Assembled at TICP using Ag bond wire, EN-4900 die attach and G631 mold compound material.Assembled at ASE using Au bond wire, EN-4900 die attach and G631 mold compound material.Post Change:Assembled at TICP using Ag bond wire, EN-4900 die attach and G631 mold compound material.Assembled at ASE using Au bond wire, EN-4900 die attach and G631 mold compound material.Assembled at MTAI using Au bond wire, 3280 die attach material and G700LTD mold compound material.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly sitePlease be advised that after the estimated first ship date customers may receive pre and post change parts
Data Sheet - 10Base-T/100Base-TX PHY with RMII Support Microchip has released a new DeviceDoc for the KSZ8081RNA/RND - 10Base-T/100Base-TX PHY with RMII Support of devices.Description of Change: 1) Section 6.0, Electrical Characteristics: Corrected the CMOS Level Inputs section and added CMOS Level Outputs section in the EC table from KSZ8081MLX (DS00002264B).Reason for Change: To Improve ManufacturabilityPlease be advised that this is a change to the document only the product has not been changed.
CCB 2672.002 and CCB 2672.003 Initial Notice: Qualification of ASE as a new assembly site for selected products of the 110nm wafer technology at DBHU available in 24L VQFN(4X4X0.9mm) and 32L VQFN(5X5X0.9mm) packages using palladium coated copper wire with gold flash (CuPdAu) bond wire. PCN Status: Initial notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of ASE as a new assembly site for selected products of the 110nm wafer technology at DBHU available in 24L VQFN(4X4X0.9mm) and 32L VQFN 5X5X0.9mm) packages using palladium coated copper wire with gold flash (CuPdAu) bond wirePre Change: Assembled at TICP using silver (Ag) bond wire Post Change: Assembled at ASE using palladium coated copper wire with gold flash (CuPdAu) bond wire. Reason for Change: To improve manufacturability by qualifying ASE as new assembly siteChange Implementation Status: In Progress Estimated Qualification Completion Date: November 2018
Microchip has released a new DeviceDoc for the KSZ8081MLX - 10Base-T/100Base-TX PHY of devices.Description of Change: 1) Updated Register 5h, Bits 4:0 to 0_0000 ,Updated Register 7h, Bit 15 to Reserved and RO, Updated Register 18h, Bits 5:0 to RO and 00_0001,Updated Register 1Eh, Bit 3 to RO in Table 42) Added CMOS Level Inputs values and clarified CMOS Level Outputs section in Table 6-1Reason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 27 Feb 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.
SYST-19UYEG888 Microchip has released a new DeviceDoc for the KSZ8081MNX/RNB - 10Base-T/100Base-TX PHY of devices.Description of Change: 1) Updates to the following addresses 4.15, 5.4:0, 7.15, 18.5:0 and 1E.3 for Table 4-2, "Register Description"2) Values for Total Chip Power modified for Table 3-9 and 3-10.Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 24 Jan 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.
Data Sheet - KSZ8081MNX/RNB - 10Base-T/100Base-TX PHY Data Sheet Document RevisionDescription of Change: 1) Updated info for pins 18, 28, and 29 in Table 2-2, "Strap-In Options- KSZ8081MNX" 2) Updated image in Figure 8-1 3) Corrected PIS code matrix.NOTE: Please be advised that this is a change to the document only the product has not been changed.
ERRATA - KSZ8081/KSZ8091 Silicon Errata and Data Sheet Clarification Errata Document Revision Description of Change: 1)Added parts to table 1. 2) Updated module 1 to include which parts are affected. 3)Added module 2. NOTE: Please be advised that this is a change to the document only the product has not been changed.
ECCN
Informations de livraison
Stock : 0
Sur commande :Order inventroy details 12 000
Sur commande
Stock d'usine :Stock d'usine : 0
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
Délai d'usine : 18 Semaines
Quantité | Prix Internet |
---|---|
1 000+ | $0.76 |
Attributs
No of Functions / Channels | 1 |
Interface Circuit Type | RMII |
Supply Voltage-Nom | 1.8V to 3.3V |
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