Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
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Référence fabricant
AT24C02C-SSHM-B
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100 par Tube
SOIC-8
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Product Category: 8-Bit Microcontrollers, MemoryNotification Subject: CCB 8431.001 Initial Notice: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 25LC08xx, 25CS08xx, 25AA08xx, AT2508xx, 25AA16xx, 25LC16xx, 25CS16xx, AT2516xx, 93C76Axx,93C86Axx, 93LC76xx, 93LC86xx, 93AA76xx, 93AA86xx, 93C76Bxx, 93C86Bxx, 93C76Cxx, 93C86Cxx, AT93C8xx, 24LC02xx, 24LC01xx, 24AA01xx, 24AA02xx, AT24C0xx, 24AA04xx, ATtinyxx, AT25M0xx, AT24C5xx,AT24CMxx,25LC25xx,25AA25xxNote: See attached SPCN document for more detailed description Description of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 25LC08xx, 25CS08xx, 25AA08xx, AT2508xx, 25AA16xx, 25LC16xx, 25CS16xx, AT2516xx, 93C76Axx, 93C86Axx, 93LC76xx, 93LC86xx, 93AA76xx, 93AA86xx, 93C76Bxx, 93C86Bxx, Note: See attached SPCN document for more detailed description Reason for Change: To improve manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound at MTAI assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: October 2026
Product Category: 8-Bit Microcontrollers, MemoryDescription of Change: Qualification of MMT as an additional assembly site for selected 24AA0xx, 24AA014x, 24AA024x, 24AA025, 24AA025Exx, 24AA025UID, 25LC080D, 24AA16, 24AA16H, 24FC0xx, 24FC16, 24FC16H, 24LC014x, 24LC024x, 24LC025, 24LC01Bx, 24LC02Bx, 24LC04Bx, 24LC08Bx, 24LC16Bx, 25AA080x, 25AA128, 25AA160x, 25AA256, 25AA320A, 25AA640A, 25CS160, 25CS320, 25CS640, 25LC080Cx, 25LC128, 25LC160x, 25LC256, 25LC320A, 25LC640A, 93AA76x, 93AA86x, 93C76x, 93C86x, 93LC76x, 93LC86x, AT24C01x, AT24C02x, AT24C04x, AT24C08x, AT24C16x, AT24CM02, AT25080B, AT25160B, AT93C86A, ATtiny13x and ATtiny25 device families available in 8L SOIC (.150in) package.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: September 2026
Product Category: Crypto Authentication, Crypto Memory, MemoryDescription of Change: Implement new packing materials and packing changes for AT34C02D, AT24C08D, AT24HC02C, AT88SC0104CA, AT88SC1616C, AT88SC0404CA, AT24MAC602, ATSHA204A, ATECC608A, ATECC508A, AT93C66B, ATECC108A, ATECC608C, AT24C16C, AT88SC0808CA, AT25160B, AT25080B, 25CS160, 24LC64, AT24C01C, AT24C04C, AT24C128C, AT24C04D, 24AA16H, AT24C08C, 24AA02H, 24LC04B, 24LC16B, AT93C56B, 24AA04H, 24AA01H, 24LC04BH, 24LC02BH, 24LC01BH, 25AA640A, 25LC640A, AT93C46E, 25CS640, AT24CM01, AT24C256C, 24AA256, AT24C512C, 24AA512, 24LC512, AT24C02C, AT25320B, 24LC256, 24FC256, 24FC512, AT24CM02, AT24C64B, AT24HC04B, AT24MAC402, AT24C16D, 25CSM04, AT93C86A, AT93C46D, AT24C02D and AT24C64D device families available in 8L SOIC and TSSOP (3.90mm and 4.4mm) packages.Reason for Change: To improve manufacturability by implementing new packing materials and packing changes.Estimated First Ship Date: 17 July 2026 (date code: 2629)
***UPDATE OF PCN112076 & PCN114907***Revision History: April 3, 2025: Issued initial notification.August 4, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 31, 2025. August 6, 2025: Re-issued final notification to update the attachment.Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5).Estimated First Ship Date: 31 August 2025 (date code: 2535)
***UPDATE OF PCN112076***Revision History: April 3, 2025: Issued initial notification.August 4, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 31, 2025.Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5).Estimated First Ship Date: 31 August 2025 (date code: 2535)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected AT24C04C, AT24C02C, AT24C01C, AT24C32D, AT24C256C, ATtiny25, ATtiny13A, ATtiny13, 25LC256, 25AA256, 25LC128 and 25AA128 device families available in 8L SOIC (.150in).Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5). Estimated Qualification Completion Date: May 2025
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
