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Manufacturer Part #
SST26VF016BT-104I/SM
SST26VF016B Series 16 Mb (2M x 8) 3.6V Serial Quad I/O (SQI) Flash Memory-SOIJ-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:2100 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount |
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Microchip SST26VF016BT-104I/SM - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update of FPCN 119261 ***Revision History:February 23, 2026: Issued initial notification.February 26, 2026: Re-issued initial notification to include SOIJ package in the Notification subject.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST26VF016B, SST26VF016BEUI, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST25VF080B, SST25VF040B, SST26WF064C, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST25VF020B, SST25PF020B, SST26VF080A, SST26VF040A, SST26VF020A, USBF8100, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26WF016B and SST26WF016BA device families available in 8L SOIC and SOIJ (.208in and .150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.Estimated Qualification Completion Date: April 2026
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST26VF016B, SST26VF016BEUI, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST25VF080B, SST25VF040B, SST26WF064C, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST25VF020B, SST25PF020B, SST26VF080A, SST26VF040A, SST26VF020A, USBF8100, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26WF016B and SST26WF016BA device families available in 8L SOIC (.208in and .150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach materialEstimated Qualification Completion Date: April 2026
Data Sheet - SST26VF016B-3.0V 16 Mbit Serial Quad I/O (SQI) Flash Memory Data Sheet Document Revision Description of Change: 1) Removed the SST26VF016BA device from the data sheet. 2) Added Part MarkingsNOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SST26VF016BT-104I/SM&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--nvram--quantum-trap-nvsram/sst26vf016bt-104i-sm-microchip-7144092
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SST26VF016BT-104I/SM&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--nvram--quantum-trap-nvsram/sst26vf016bt-104i-sm-microchip-7144092
Microchip SST26VF016BT-104I/SM - Technical Attributes
| Memory Density: | 16Mb |
| Memory Organization: | 2M x 8 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Access Time-Max: | 8ns |
| Interface: | Quad I/O/SPI |
| Temperature Grade: | Industrial |
| Operating Temp Range: | -40°C to +85°C |
| Moisture Sensitivity Level: | 1 |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2100 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount