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Manufacturer Part #
PIC16F18325-E/SL
14KB Flash, 256B EEPROM, 1KB RAM, 12 I/O, 10-bit PWMs, CCP, CWG
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:57 per Tube | ||||||||||
| Date Code: | |||||||||||
Microchip PIC16F18325-E/SL - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Cancellation NotificationReason for ChangeMicrochip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF15xx and PIC16LF18xx device families available in 14L SOIC (.150in) package.
PCN Status: Initial NotificationPCN Type:Manufacturing Change Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF153xx, PIC16LF183xx, PIC16LF184xx, PIC18F04Q4xx, PIC18F05Q4xx and PIC18F06Q4xx device families available in 14L and 8L SOIC (3.90mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2023Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF15xx and PIC16LF18xx device families available in 14L SOIC (.150in) package.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size.
Microchip has released a new Datasheet for the PIC16(L)F18325/18345 Full-Featured, Low Pin Count Microcontrollers with XLP Data Sheet of devices. Notification Status: FinalDescription of Change:Updated revision letter; updated package drawings.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 22 Sep 2022
Microchip has released a new Errata for the PIC16(L)F18325/18345 Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change:Updated Data Sheet Revision Letter.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 22 Sep 2022
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC16F18325-E/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--8-bit/pic16f18325-e-sl-microchip-2100952
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC16F18325-E/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--8-bit/pic16f18325-e-sl-microchip-2100952
Available Packaging
Package Qty:
57 per Tube