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Référence fabricant
PIC16F18344-I/GZ
PIC16F Series 7 kB Flash 512 B RAM 32 MHz 8-Bit Microcontroller - UQFN-20
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :91 par Tube Style d'emballage :UQFN-20 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip PIC16F18344-I/GZ - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change: Qualification of Panel Level Package (PLP) packaging process technology available in 40L UQFN (5x5x0.5mm), 28L UQFN (4x4x0.55mm), 16L UQFN (3x3x0.5mm), 20L UQFN (4x4x0.5mm), 16L UQFN (4x4x0.5mm) and 40L UPQFN (5x5x0.5mm) packages at MP3A assembly site.Reason for Change: To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at MP3A assembly site.Estimated Qualification Completion Date: January 2026
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of MPHL as an additional final test site for selected AR1010, AR1011, AR1020, AR1021, OUC16F1768, PIC16F15344, PIC16F1768, PIC16F1769, PIC16F18344, PIC16F18444, PIC16F18445, PIC16F18446, PIC16F527, PIC16F631, PIC16F677, PIC16F685, PIC16F687, PIC16F689 and PIC16F690 device families available in 20L QFN (4x4x0.9mm) and 20L UQFN (4x4x0.5mm) packages.Reason for Change: To improve manufacturability by qualifying MPHL as an additional final test site.Estimated First Ship Date: 09 August 2025 (date code: 2532)
Description of Change: This qualification was initially performed to qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change: Microchip has decided to not qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Revision History: March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.December 17, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list to add PIC18F46K22-E/MVC01 and PIC18F46K22T-E/MVC01 catalog part numbers. Updated post change mold compound material to NEPL Proprietary. Provided estimated first ship date to be on January 15, 2025.February 11, 2025: Re-issued final notification to include the Lead-frame package at MMT in the post change summary table. March 12, 2025: Issued cancellation notification.
Microchip has released a new Document for the PIC16(L)F18324/18344 Family Silicon Errata and Data Sheet Clarifications of devices. Notification Status: FinalDescription of Change:Updated the document format to the current Microchip publication standard, module numbers under silicon errata have been renumbered accordingly; added Data Sheet Clarification 2.1.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity Change Implementation Status: CompleteDate Document Changes Effective: 11 Feb 2025
PCN Status:Final NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Revision History:March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=PIC16F18344-I/GZ&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--8-bit/pic16f18344-i-gz-microchip-5095340
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=PIC16F18344-I/GZ&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--8-bit/pic16f18344-i-gz-microchip-5095340
Microchip PIC16F18344-I/GZ - Caractéristiques techniques
| Family Name: | PIC16F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 7kB |
| RAM Size: | 512B |
| Speed: | 32MHz |
| No of I/O Lines: | 18 |
| InterfaceType / Connectivity: | I2C/LIN/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 2.3V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 17-chx10-bit |
| On-Chip DAC: | 1-chx5-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | UQFN-20 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
91 par Tube
Style d'emballage :
UQFN-20
Méthode de montage :
Surface Mount