
Manufacturer Part #
ATF1502ASV-15AU44
CPLS
Product Specification Section
Microchip ATF1502ASV-15AU44 - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
File
Date
Material Change
07/23/2025 Details and Download
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Part Status:
Active
Active
Microchip ATF1502ASV-15AU44 - Technical Attributes
Attributes Table
No of I/O Lines: | 32 |
No of Macrocells: | 32 |
Propagation Delay: | 15ns |
Supply Voltage: | 3V to 3.6V |
Operating Temp Range: | -40°C to +85°C |
Storage Temperature Range: | -65°C to +150°C |
Frequency: | 100MHz |
No of Pins: | 44 |
Leakage Current: | 2µA |
Package Style: | TQFP-44 |
Mounting Method: | Surface Mount |
Pricing Section
Global Stock:
320
USA:
320
On Order:
0
Factory Lead Time:
22 Weeks
Quantity
Unit Price
1
$2.11
20
$2.07
40
$2.05
125
$2.01
250+
$1.97
Product Variant Information section
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-44
Mounting Method:
Surface Mount