text.skipToContent text.skipToNavigation

 

Future Electronics

 

Orion Development Board 

A Collaboration Between Future Electronics and Laird Connectivity 

The Orion adaptor boards are designed by Future Electronics to showcase the Laird Connectivity Sterling™-LWB+ and Sterling-LWB5+ embedded Wi-Fi modules. The Orion design is implemented in two versions with Laird Connectivity Sterling™-LWB+ and Sterling-LWB5+ embedded Wi-Fi modules respectively, to make application development and evaluation easy. Both boards support ST Micro Nucleo-144 adaptor for easy evaluation with STM32 MCUs and MikroBus header that enables further expansion.

The Laird Connectivity Sterling™-LWB+ is a Wi-Fi 4 with Bluetooth 5.2 module based upon the Infineon AIROC™ CYW43439 chipset. The LWB5+ series wireless module, powered by Infineon’s CYW4373E silicon, is an integrated, small form factor 1x1 SISO 802.11 a/b/g/n/ac WLAN plus dual-mode Bluetooth® 5.2 Low Energy module that is optimized for low-power mobile devices. These modules are purpose-built for industrial IoT connectivity through a secure, reliable, and robust feature set. Both modules are supported by the Infineon’s STM32 Connectivity Expansion Pack 1.5.1 for STM32CubeMX tool, for ease of application development.

 Features

  • Laird Sterling™ LWB+ or LWB5+ module
  • ST Micro Nucleo-144 adaptor to support the STM32 MCUs
  • SPI flash on board
  • MikroBus header for expansion