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Manufacturer Part #
MPLAD18KP14CA
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Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of PYNM and RECT as an additional fabrication site and implementation of NiAg as an additional heat sink base material for selected LZ7xx, MAPLADxx, MPLADxx, MXLPLADxx, and MXPLADxx device families available in PLAD package.Reason for Change:To improve manufacturability and on-time delivery performances by qualifying PYNM and RECT as an additional fabrication site and implementation of NiAg as an additional heat sink base material.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.