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Référence fabricant
MCP6234-E/SL
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57 par Tube
SOIC-14
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Microchip has released a new Datasheet for the MCP6231/1R/1U/2/4 - 20 uA, 300 kHz Rail-to-Rail Op Amp Data Sheet of devices. If you are using one of these devices please read the document located at MCP6231/1R/1U/2/4 - 20 uA, 300 kHz Rail-to-Rail Op Amp Data Sheet.Notification Status: FinalDescription of Change:? Updated Product Identification System.? Added Product Identification System (Automotive).? Made minor text and format changes throughout the document.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 21 Jun 2023 NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
The MCP6234 series of operational amplifiers (op amps) provide wide bandwidth for the quiescent current. The MCP6234 family has a 300 kHz gain bandwidth product and 65°C (typical) phase margin.
This family operates from a single supply voltage as low as 1.8 V, while drawing 20 µA (typical) quiescent current. In addition, the MCP6234 family supports rail-to-rail input and output swing, with a common mode input voltage range of VDD + 300 mV to VSS – 300 mV. These op amps are designed in one of Microchip’s advanced CMOS processes
Features:
Applications:
View the complete product family of MCP623x Operational Amplifiers
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