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Manufacturer Part #
SY100EP57VK4G-TR
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1000 per Reel
TSSOP-20
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Wafer Size changed from 8" to 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated Qualification Completion Date: January 2026
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of NSEB as a new assembly site for SY100EPxxx and SY89645L device families available in 20L TSSOP (4.4mm) package.Reason for Change:To improve on-time delivery performance by qualifying NSEB as a new assembly site.
Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Part Status:
The SY100EP57VK4G TR is a high-speed, low-skew, fully differential PECL/ECL 4:1 multiplexer in a 20-pin TSSOP package. This device is a pin-for-pin, plug-in replacementto the MC10/100EP57DT. The signal-path inputs (D0:D3) accept differential signals as low as 150 mVpk-pk. All I/O pins are 100K EP PECL/ECL logic compatible. AC–performance is guaranteed over the industrial –40°C to +85°C temperature range and 3.0 V to 5.5 V supply voltage range.
This device will operate in PECL/LVPECL or ECL/ LVECL mode. The SY100EP57 propagation delay is less than 520 ps, and the Select-to-valid output delay is less than 575 ps over temperature and voltage. For clock applications, the high-speed design combined with an extremely fast rise/fall time of less than 220 ps produces a toggle frequency as high as 3 GHz (400 mVpk-pk swing). Two VBB output reference pins (approx equal to VCC–1.4 V) are available for AC–coupled or single-ended applications. The SY100EP57V is part of Micrel’s high-speed, Precision Edge timing and distribution family. For applications that require a different I/O combination, consult the Micrel website at www.micrel.com, and choose from a comprehensive product line of high-speed, low skew fanout buffers, translators, and clock dividers.
Key Features:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.