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Manufacturer Part #
MCP9805-BE/ST
MCP9805 Series 3.6 V Memory Module Digital Temperature Sensor - TSSOP-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:TSSOP-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP9805-BE/ST - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of MMT as an additional assembly site for selected 24AA044, 24AA256UID, 24LC08B, 25AA256X, 25LC256X, 34AA04 and MCP9805 device families available in 8L TSSOP (4.4mm) package using CuPdAu wire.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using CuPdAu wire.Change Implementation Status:In ProgressEstimated First Ship Date:December 28, 2023 (date code: 2352)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
PCN Status: Final NotificationDescription of Change: Qualification of MMT as an additional assembly site for selected 24LC08B, 24AA0xx, 24AA256UID, 25LC256, 25AA256, 34AA04 and MCP9805 device families available in 8L TSSOP (4.4mm) package using CuPdAu bond wire material.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site using CuPdAu bond wire material.
Description of Change:Qualification of MMT as an additional assembly site for selected 24LC08B, 24AA0xx, 24AA256UID, 25LC256, 25AA256, 34AA04 and MCP9805 device families available in 8LTSSOP (4.4mm) package using CuPdAu bond wire material.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using CuPdAu bond wire material.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP9805-BE/ST&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--analog--sensors--temperature/mcp9805-be-st-microchip-9430935
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP9805-BE/ST&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--analog--sensors--temperature/mcp9805-be-st-microchip-9430935
Microchip MCP9805-BE/ST - Technical Attributes
| Output Type: | Digital |
| Supply Voltage: | 3V to 3.6V |
| Operating Temp Range: | -40°C to +125°C |
| Operating Temp Range (°F): | -40°F to +257°F |
| Package Style: | TSSOP-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP9805 series of digital temperature sensor converts temperatures between -40°C and +125°C to a digital word. This sensor is designed to meet the JEDEC standard JC42.4 for Mobile Platform Memory Module Thermal Sensor.
This device provides an accuracy of ±1°C (max.) from a temperature range of +75°C to +95°C (active range) and ±2°C (max.) from +40°C to +125°C (monitor range) as defined in the JEDEC standard.
Features:
- Meets JEDEC Standard JC42.4 for Mobile Platform Memory Module Thermal Sensor
- Temperature-to-Digital Converter
- Accuracy with 0.25 °C/LSb Resolution:
- ±1°C (max.) from +75°C to +95°C
- ±2°C (max.) from +40°C to +125°C
- ±3°C (max.) from -20°C to +125°C
- Programmable Temperature Monitor Boundary
- Critical Temperature Output
- Operating Voltage Range: 3.0 V to 3.6 V
- 2-wire Interface: SMBus/Standard mode I2C™ Compatible
- Operating Current: 200 µA (typ.)
- Shutdown Current: 0.1 µA (typ.)
- Available Packages: 2x3 DFN-8, TSSOP-8
Applications:
- Dual In-line Memory Module (DIMM)
- Personal Computers (PCs) and Servers
- Hard Disk Drives and Other PC Peripherals
- General Purpose Temperature Sensor
Available Packaging
Package Qty:
100 per Tube
Package Style:
TSSOP-8
Mounting Method:
Surface Mount
