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Manufacturer Part #
APT30DQ60BHBG
APT30DQ60 Series 600 V 30 A Ultrafast Soft Recovery Rectifier Diode - TO-247-3
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:1 per Tube Package Style:TO-247-3 Mounting Method:Through Hole |
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Microchip APT30DQ60BHBG - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*****FPCN117764/FPCN118009 UPDATE*****Revision History: December 05, 2025: Issued final notification.December 10, 2025: Re-issued final notification to remove TO-247 products in the Notification Subject and Description of Change.January 06, 2025: Re-issued final notification to change Impacts to Data Sheet to Yes.Note: The change described in this PCN does not alter Microchip's current regulatory compliance Description of Change:Re-issued final notification to change Impacts to Data Sheet to Yes.Reason for Change:To improve productivity by a change in terminal plating.
Description of Change:Rev AInitial release of documentMicrochip has released a new Document for the Lead Finish Change from Tin-Silver-Copper (SAC) to 100% Tin (Sn) of devices. If you are using one of these devices please read the document located at Lead Finish Change from Tin-Silver-Copper (SAC) to 100% Tin (Sn).Date Document Changes Effective: 23 Dec 2025
Description of Change:Qualification of Tin (Sn) as a new terminal plating for selected APL502, APL602, APT100, APT10M, APT11N, APT120, APT13G, APT150, APT15D, APT15G, APT200, APT20G, APT20M, APT25G, APT30D, APT30G, APT30M, APT30S, APT33G, APT35G, APT401, APT40D, APT40G, APT40M, APT45G, APT47N, APT501, APT502, APT50G, APT50M, APT601, APT602, APT603, APT60D, APT60M, APT60S, APT65G, APT75G, APT801, APT802, APT803, APT804, APT805, APT806, APT807, APT80G, APT94N, CC1105, CC1215, CC2515, CC3037, CC3038, CC3069 and CC3125 Microsemi Power Discrete products.Reason for Change:To improve productivity by a change in terminal plating.Estimated First Ship Date:02 January 2026 (date code: 2601)
Description of Change: Qualification of Tin (Sn) as a new terminal plating for selected APL502, APL602, APT100, APT10M, APT11N, APT120, APT13G, APT150, APT15D, APT15G, APT200, APT20G, APT20M, APT25G, APT30D, APT30G, APT30M, APT30S, APT33G, APT35G, APT401, APT40D, APT40G, APT40M, APT45G, APT47N, APT501, APT502, APT50G, APT50M, APT601, APT602, APT603, APT60D, APT60M, APT60S, APT65G, APT75G, APT801, APT802, APT803, APT804, APT805, APT806, APT807, APT80G, APT94N, CC1105, CC1215, CC2515, CC3037, CC3038, CC3069 and CC3125 Microsemi Power Discrete TO-247 products.Reason for Change: To improve productivity by a change in terminal platingEstimated First Ship Date: 02 January 2026 (date code: 2601)
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.***Issued final notification. Provided estimated first ship date to be on June 29, 2024.
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.
Part Status:
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Microchip APT30DQ60BHBG - Technical Attributes
| Average Rectified Current-Max: | 30A |
| Peak Current-Max: | 320A |
| Reverse Voltage-Max [Vrrm]: | 600V |
| Reverse Current-Max: | 25µA |
| Forward Voltage: | 2V |
| Configuration: | Dual |
| Forward RMS Current [If rms]: | 51A |
| Diode Capacitance-Max: | 36pF |
| Reverse Recovery Time-Max: | 30ns |
| Thermal Resistance: | 1.5°C/W |
| Operating Temp Range: | -55°C to +175°C |
| Storage Temperature Range: | -55°C to +175°C |
| Package Style: | TO-247-3 |
| Mounting Method: | Through Hole |
Available Packaging
Package Qty:
1 per Tube
Package Style:
TO-247-3
Mounting Method:
Through Hole