Manufacturer Part #
IRFP150NPBF
Single N-Channel 100V 36 mOhm 110 nC HEXFET® Power Mosfet - TO-247AC
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| Mfr. Name: | Infineon | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:25 per Tube Package Style:TO-247AC Mounting Method:Flange Mount | ||||||||||
| Date Code: | 2147 | ||||||||||
Infineon IRFP150NPBF - Product Specification
Shipping Information:
ECCN:
PCN Information:
Subject Change of the wafer production location from Infineon Technologies Temecula, USA and EPISIL Technologies Inc., Taiwan to Sichuan Gen Microelectronics co.LTD, China for dedicated GEN5 and GEN7 N-Channel MOSFET productsReason The wafer production of the affected products will be transferred to Sichuan Gen Microelectronics co.LTD, China, according to global Infineon production strategy
Detailed change information:Subject Phase out of Kyocera KEG300 mold compound for several assembly locations and change of lead finish from tin dip to electroplating at Tijuana, Mexico for dedicated TO220-3 & TO247-3 products.Reason:To ensure continuity of mold compound supply due to Kyocera KEG300 end of life and to further ensure our product performance with lead-free electroplating finish
Part Status:
Infineon IRFP150NPBF - Technical Attributes
| Fet Type: | N-Ch |
| No of Channels: | 1 |
| Drain-to-Source Voltage [Vdss]: | 100V |
| Drain-Source On Resistance-Max: | 0.036Ω |
| Rated Power Dissipation: | 160W |
| Qg Gate Charge: | 110nC |
| Gate-Source Voltage-Max [Vgss]: | 20V |
| Drain Current: | 42A |
| Turn-on Delay Time: | 11ns |
| Turn-off Delay Time: | 45ns |
| Rise Time: | 56ns |
| Fall Time: | 40ns |
| Operating Temp Range: | -55°C to +175°C |
| Gate Source Threshold: | 4V |
| Technology: | Advanced Process Technology |
| Height - Max: | 20.3mm |
| Length: | 15.9mm |
| Input Capacitance: | 1900pF |
| Package Style: | TO-247AC |
| Mounting Method: | Flange Mount |
Features & Applications
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The TO-247 package is preferred for commercial-industrial applications where higher power levels preclude the use of TO-220 devices. The TO-247 is similar but superior to the earlier TO-218 package because of its isolated mounting hole.
Features
Advanced Process Technology
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
Lead-Free
Available Packaging
Package Qty:
25 per Tube
Package Style:
TO-247AC
Mounting Method:
Flange Mount