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Manufacturer Part #
R6007ENX
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Description:Application for change due to discontinuation of wafer coating (polyimide) (HVMOS)Reason for change:The polyimide material used for wafer coating will be discontinued and will be replaced by an alternative material for continued supply.
PowerTransistor_Material change(organic film) and Addition of Shiga Factory for High Voltage MOSFET.Chamge Details: Before:Factory:RohmApollo ChikugoOrganic Film:Polyimide After:Factory:RohmApollo Chikugo and Rohm Shiga FactoryOrganic Film:Polyimide Reason:This transfer will increase production capacity and stabilize production which contribute to BCP, and the organic thin film materials contain an environmental regulation.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.