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Manufacturer Part #
24FC02-I/ST
24FC02 Series 2 Kbit (256 x 8) 1.7 V 1 MHz Surface Mount I²C EEPROM - TSSOP-8
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| Mfr. Name: | Microchip | ||||||||||
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Product Variant Information section
Available PackagingPackage Qty:100 per Std. Mfr. Pkg Package Style:TSSOP-8 Mounting Method:Surface Mount |
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Microchip 24FC02-I/ST - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 25LC128, 25AA128, 25AA256, 25LC256, 24LC024, 24LC025, 24AA024, 24AA044, 24LC014, 24AA014, 24AA025, AT93C86, 93LC76C, 93AA76C, 93LC86C, 93AA86C, 93C76C, 93C86C, 93LC76A, 93LC76B, 93AA76B, 93AA76A, 93C86A, 93C86B, 93AA86A, 93C76A, 93C76B, 93LC86A, 93LC86B, 93AA86B, 24AA01H, 24LC04B, 24AA02, 24LC02B, 24LC01B, 24FC02, 24FC04, 24AA01, 24FC04H, 24FC01, 24AA04, 24AA02H, 24AA04H, 24FC16, 24LC16B, 24AA08, 24LC08B, 24AA16H, 24AA08H, 24FC08, 24AA16, 25AA080, 25LC080, 25AA160, AT25080, 25LC160, AT25160, AT25320, 25CS320, 25AA320, 25LC320, 25LC640, 25CS640, and 25AA640 device families available in 8L TSSOP (4.4mm) package at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material at MMT assembly site.Change Implementation Status: In ProgressEstimated First Ship Date: 15 April 2026 (date code: 2616)
*** Update for PCN 116117 ***Revision History:October 13, 2025: Re-issued to update the affected CPN listDescription of Change:Microchip has released a new Datasheet for the 24AA02/24LC02B/24FC02 - 2-Kbit I2C Serial EEPROM of devices.Added 4 million E/W cycles for FC devices only; Added Q6B package outline drawing; Minor editorial updates throughout the document.Date Document Changes Effective: 22 Sep 2025
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Part Status:
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Microchip 24FC02-I/ST - Technical Attributes
| Memory Density: | 2kb |
| Memory Organization: | 256 x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Data Retention: | 200 yr |
| Interface Type: | I2C / Serial |
| Access Time-Max: | 450ns |
| Operating Temp Range: | -40°C to +85°C |
| No of Terminals: | 8 |
| Package Style: | TSSOP-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
100 per Std. Mfr. Pkg
Package Style:
TSSOP-8
Mounting Method:
Surface Mount