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Référence fabricant
SST49LF008A-33-4C-NHE
SST49LF Series 8 Mbit 1024 K x 8 3.3 V Firmware Hub - PLCC-32
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :30 par Tube Style d'emballage :PLCC-32 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2521 | ||||||||||
Microchip SST49LF008A-33-4C-NHE - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Microchip has released a new Datasheet for the SST49LF008A - 8-Mbit Firmware Hub of devices.Corrected alignment for 32-Lead TSOP package marking; minor editorial updates throughout the document.Reason for Change: To improve productivityDate Document Changes Effective: 12 Jun 2025
Sunject:Microchip has released a new Datasheet for the SST49LF008A - 8-Mbit Firmware Hub of devices. If you are using one of these devices please read the document located at SST49LF008A - 8-Mbit Firmware Hub.Description of Change:Corrected 32-Lead PLCC and 32-Lead TSOP package markings.Reason for Change: To Improve ProductivityDate Document Changes Effective: 19 Feb 2025
PCN Status:Final NotificationRevision History:August 26, 2022: Issued initial notification.December 6, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 22, 2022.PCN Type:Manufacturing ChangeMicrochip Parts Affected:Please open one of the files found in the Affected CPNs section.Note: For your convenience Microchip includes identical files in two formats (.pdf and .xls)Description of Change:Qualification of MTAI as a new final test site for selected SST49LF008A and SST49LF080A device families available in 32L TSOP (8x14mm) and 32L PLCC (11.5x14x3.37mm) packages.Pre and Post Change Summary: see attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MTAI as new final test site.Change Implementation Status:In ProgressEstimated First Ship Date:December 21, 2022 (date code: 2252)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: see attached
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SST49LF008A-33-4C-NHE&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--memory--flash--norflash--serial/sst49lf008a-33-4c-nhe-microchip-3889425
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SST49LF008A-33-4C-NHE&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--memory--flash--norflash--serial/sst49lf008a-33-4c-nhe-microchip-3889425
Microchip SST49LF008A-33-4C-NHE - Caractéristiques techniques
| Clock Frequency-Max: | 33MHz |
| Memory Density: | 8Mb |
| Memory Organization: | 1 M x 8 |
| Supply Voltage-Nom: | 3V to 3.6V |
| Temperature Grade: | Commercial |
| Style d'emballage : | PLCC-32 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
NOTE: This SST product is migrating to the preferred Microchip (MCP) part number. All products bearing the Microchip part number are identical in form, fit and function to the products with the legacy SST prefix/logo mark.
The SST49LF008A-33-4C-NHE is a part of SST49LF Series Flash Memory. It has an standard operating temperature ranging from 0°C to +70°C, it comes in PLCC-32 package.
The SST49LF008A flash memory devices are designed to be read-compatible with the Intel 82802 Firmware Hub (FWH) device for PC-BIOS application. These devices provide protection for the storage and update of code and data in addition to adding system design flexibility through five general purpose inputs.
Features:
- Firmware Hub for Intel 8xx Chipsets
- 8 Mbit SuperFlash memory array for code/data: storage– 1024 K x8
- Flexible Erase Capability:
- Uniform 4 KByte Sectors
- Uniform 64 KByte overlay blocks
- 64 KByte Top Boot Block protection
- Chip-Erase for PP Mode Only
- Single 3.0-3.6 V Read and Write Operations
- Superior Reliability
- Endurance:100,000 Cycles (typical)
- Greater than 100 years Data Retention
- Low Power Consumption
- Active Read Current: 6 mA (typical)
- Standby Current: 10 µA (typical)
- Two Operational Modes
- Firmware Hub Interface (FWH) Mode for In-System operation
- Parallel Programming (PP) Mode for fast production programming
- Parallel Programming (PP) Mode
- 11-pin multiplexed address and 8-pin data I/O interface
- Supports fast In-System or PROM programming for manufacturing
- CMOS and PCI I/O Compatibility
- All non-Pb (lead-free) devices are RoHS compliant
View the complete SST49LF Series of Flash Memory
Emballages disponibles
Qté d'emballage(s) :
30 par Tube
Style d'emballage :
PLCC-32
Méthode de montage :
Surface Mount