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Manufacturer Part #
PIC32MX470F512H-I/PT
PIC32MX Series 512 kB Flash 128 kB RAM SMT 32-Bit Microcontroller - TQFP-64
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray Package Style:TQFP-64 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2331 | ||||||||||
Microchip PIC32MX470F512H-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Errata for the PIC32MX330/350/370/430/450/470 Family Silicon Errata and Data Sheet Clarification of devices.Description of Change:The following updates were performed in this revision.? The note was clarified in silicon issue 11. Module: ?USB?? Added silicon issue 26. Module: ?Flash: RTSP?Reason for Change: To Improve Productivity
ERRATA - PIC32MX330/350/370/430/450/470 Family Silicon Errata and Data Sheet Clarification Silicon Die Revision Addition and Errata Document RevisionDescription of Change: 1) The document was updated for silicon revision B0 devices. 2) 128 KB devices were moved from Table 1 to Table 2 3) Added separate 128 KB row to Affected Silicon Revisions tables 4) Added silicon issues 15 (UART), 16 (UART), 17 (CTMU), 18 (ADC), 19 (HVD), and 20 (Power-Saving Modes), 21 (Flash Memory), and 23 (Flash Memory) 5) Deleted silicon issue 3 (CTMU)
Part Status:
Microchip PIC32MX470F512H-I/PT - Technical Attributes
| Family Name: | PIC32MX |
| Core Processor: | MIPS32 M4K |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 512kB |
| RAM Size: | 128kB |
| Speed: | 80MHz |
| No of I/O Lines: | 51 |
| InterfaceType / Connectivity: | IrDA/I2C/LIN/PMP/SPI/UART/USART/USB OTG |
| Peripherals: | Brown-out Detect/DMA/POR/PWM/Reset/Watchdog |
| Number Of Timers: | 5 |
| Supply Voltage: | 2.3V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 28-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-64 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-64
Mounting Method:
Surface Mount