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Manufacturer Part #
ATMEGA329PV-10MU
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260 per Tray
QFN-64EP
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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PCN Information:
***UPDATE OF PCN103080***Revision History: January 26, 2024: Issued initial notification.July 31, 2025: Issued final notification. Attached Qualification Report. Provided estimated first ship date to be on August 11, 2025.Description of Change: Qualification of ASEM as an additional assembly site for selected ATMEGA128x, ATMEGA165xx, ATMEGA169xx, ATMEGA64x, ATMEGA645xx, ATMEGA649xx, ATMEGA329xx, and ATMEGA325xx device families available in 64L VQFN (9x9x1mm) package.Reason for Change: To improve on-time delivery performance by qualifying ASEM as an additional assembly site.Estimated First Ship Date: 11 August 2025 (date code: 2533)
Description of Change: Qualification of ASEM as an additional assembly site for selected ATMEGA128x, ATMEGA165xx, ATMEGA169xx, ATMEGA64x, ATMEGA645xx, ATMEGA649xx, ATMEGA329xx, and ATMEGA325xx device families available in 64L VQFN (9x9x1mm) package.Reason for Change: To improve on-time delivery performance by qualifying ASEM as an additional assembly site.
Microchip has released a new Errata for the ATmega329P/ATmega3290P SEDSC of devices.Description of Change: Initial document release.
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of G700LA as a new mold compound material for selected ATMEGA64xx, ATMGA16xx, ATMEGA25xx and ATMEGA32xx device families available in 64L VQFN (9x9x1.0 mm) package.Reason for Change:To improve manufacturability by qualifying G700LA as new mold compound material.Change Implementation Status:In ProgressEstimated First Ship Date:December 23, 2022 (date code: 2252)
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
