
Manufacturer Part #
PIC16C924-04/PT
PIC16C Series 7 kB Flash 176 B SRAM SMT 8-Bit Microcontroller - TQFP-64
Microchip PIC16C924-04/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for CS500,PIC12C509, PIC12C508, PIC16C62A, PIC16C73A, PIC16C711, PIC16C620, PIC16C662, PIC16C72, PIC16C66, PIC16C715, PIC14000, PIC16C923, PIC16C622, PIC17C44, PIC16C64A, PIC16C65A, PIC16C67, PIC16C54A, PIC16C710, PIC16C76, PIC16C77, PIC16C74A, PIC16C63, PIC16C621,PIC17C43, PIC17C42A, PIC16C554, PIC16C924, PIC16C558, PIC16C642, and PIC16LV54A in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: November 2025
Part Status:
Microchip PIC16C924-04/PT - Technical Attributes
Family Name: | PIC16C |
Core Processor: | PIC |
Program Memory Type: | OTP |
Flash Size (Bytes): | 7kB |
RAM Size: | 176B |
Speed: | 4MHz |
No of I/O Lines: | 25 |
InterfaceType / Connectivity: | I2C/SPI |
Peripherals: | LCD/POR/PWM/Watchdog |
Number Of Timers: | 2 |
Supply Voltage: | 2.5V to 6V |
Operating Temperature: | 0°C to 70°C |
On-Chip ADC: | 5-chx8-bit |
Watchdog Timers: | 1 |
Package Style: | TQFP-64 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-64
Mounting Method:
Surface Mount