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Manufacturer Part #
PIC16F18326-I/SL
PIC16F18326 Series 8-Bit 32MHz 28KB FLASH Microcontroller IC SOIC-14
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:57 per Tube |
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Microchip PIC16F18326-I/SL - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Microchip has released a new Document for the PIC16(L)F18326/18346 Family Silicon Errata and Data Sheet Clarifications of devices. Notification Status: FinalDescription of Change:Added Silicon rev. A4.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 22 Jul 2024
PCN Status:Cancellation NotificationReason for ChangeMicrochip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF15xx and PIC16LF18xx device families available in 14L SOIC (.150in) package.
PCN Status: Initial NotificationPCN Type:Manufacturing Change Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF153xx, PIC16LF183xx, PIC16LF184xx, PIC18F04Q4xx, PIC18F05Q4xx and PIC18F06Q4xx device families available in 14L and 8L SOIC (3.90mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2023Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF15xx and PIC16LF18xx device families available in 14L SOIC (.150in) package.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size.
Part Status:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC16F18326-I/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--microcontrollers--8-bit/pic16f18326-i-sl-microchip-4101443
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC16F18326-I/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--microcontrollers--8-bit/pic16f18326-i-sl-microchip-4101443
Available Packaging
Package Qty:
57 per Tube