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Manufacturer Part #
MCP2562FD-H/SN
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100 per Reel
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
***UPDATE OF PCN118511 (NOTICE TYPE MATERIAL CHANGE) ***Revision History: January 16, 2026: Issued initial notification. January 19, 2026: Re-issued initial notification to update notification subject.Product Category: Interface- Controller Area Network (CAN)Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected MCP2542FD, MCP2542WFD, MCP2544FD, MCP2544WFD, MCP2557FD, MCP2558FD, MCP2561, MCP2561FD, MCP2562 and MCP2562FD device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach to standardize the use of PFAS free material at MTAI assembly site.Estimated Qualification Completion Date: May 2026
Product Category: Interface- Controller Area Network (CAN)Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for MCP2561T-H/SN, MCP2561FDT-H/SN, MCP2561-H/SN, MCP2561FD-H/SN, MCP2557FD-H/SN, MCP2558FD-H/SN, MCP2542FD-H/SN, MCP2562FDT-H/SN, MCP2562-H/SN, MCP2562FD-H/SN, MCP2562T-H/SN, MCP2542WFDH/SN, MCP2544WFD-H/SN, MCP2544FD-H/SN, MCP2561-H/SNVAO, MCP2561T-H/SNVAO, MCP2544WFDT-H/SN, MCP2542WFDT-H/SN, MCP2557FDT-H/SN, MCP2558FDT-H/SN, MCP2542FDT-H/SN, MCP2544FDT-H/SN, MCP2558FD-H/SNVAO, MCP2557FD-H/SNVAO, MCP2558FDT-H/SNVAO, MCP2557FDT-H/SNVAO, MCP2562FDT-H/SNVAO catalog part numbers (CPN) available in 8L SOIC (3.90mm) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.Estimated Qualification Completion Date: May 2026
Product Category: Interface- Controller Area Network (CAN)Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected MCP2542FD, MCP2542WFD, MCP2544FD, MCP2544WFD, MCP2557FD, MCP2558FD, MCP2561, MCP2561FD, MCP2562 and MCP2562FD device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach to standardize the use of PFAS free material at MTAI assembly site.Estimated Qualification Completion Date: May 2026Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
