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Référence fabricant
CYPD3171-24LQXQ
CCG3PA Series 64 kb Flash 8 kb RAM 24.5V 10 mA USB Type-C Port Controller-QFN-24
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :490 par Box Style d'emballage :QFN-24 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2431 | ||||||||||
Infineon CYPD3171-24LQXQ - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 109266 /Molding Compound Change ***- Original PCN N? 2024-164-A dated 2024-11-07- Delta to previous revision:- Update of First sample availability data from 2025-02-28 to 2026-03-31.- Update of the Intended start of delivery from 2025-04-15 to 2026-06-30.Subject Change of mold compound from Kyocera KEG3000NASLS, KEG3000DACY to Sumitomo EME G600CE for products from Infineon Technologies Manufacturing Ltd. Philippines Branch.Reason Experienced inconsistency delivery support from existing mold compound supplier - Kyocera. To enable sourcing flexibility and mitigate supply risk, Sumitomo is introduced as an additional mold compound supplier.DescriptionOld:- Kyocera KEG3000NASLS/KEG3000DACYNew- Sumitomo EME G600CE- Kyocera KEG3000NASLS/KEG3000DACY- Time schedule- Final qualification report Available- First samples available 2026-03-31- Intended start of delivery 2026-06-30
Description:Extension of total storage time of Finished Goods to 5 years for SMD (Surface Mount Devices) and WLCSP (Wafer Level Chip-Scale Package) packagesReason Infineon able to improve our Finished Goods storage from 2 years to 5 years without having any impact to quality and performance.Intended start of delivery - 2025-09-30
Detailed change information:Subject: Change of label affecting various products: addition of HAL-free mark.Reason: Standardization of labelling for Infineon products.Deeper integration of supply chain and detailed assessment confirmed HAL-free products in Infineon portfolio.Deliveries will start with 12.09.2025 to cascade information to Infineon customers with utmost urgency.
Description:Change of mold compound from Kyocera KEG3000NASLS, KEG3000DACY to Sumitomo EME G600CE for products fromInfineon Technologies Manufacturing Ltd. Philippines BranchReason:Experienced inconsistency delivery support from existing mold compound supplier - Kyocera. To enable sourcing flexibility and mitigate supply risk, Sumitomo is introduced as an additional mold compound supplier.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=CYPD3171-24LQXQ&field4=Infineon&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--signal-interface--usb/cypd3171-24lqxq-infineon-6097560
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=CYPD3171-24LQXQ&field4=Infineon&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--signal-interface--usb/cypd3171-24lqxq-infineon-6097560
Infineon CYPD3171-24LQXQ - Caractéristiques techniques
| Supply Voltage: | 3V to 24.5V |
| Operating Temp Range: | -40°C to +105°C |
| Interface/Version: | 3.1 |
| Interface Type: | SPI/UART/I2C/USB |
| No of Pins: | 24 |
| Supply Current: | 10mA |
| Protocols Supported: | USB |
| Frequency: | 48MHz |
| No of Ports: | Single |
| Moisture Sensitivity Level: | 3 |
| Style d'emballage : | QFN-24 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
490 par Box
Style d'emballage :
QFN-24
Méthode de montage :
Surface Mount