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Manufacturer Part #
MIC5209-5.0YS
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78 per Tube
SOT-223 (TO-261-4, SC-73)
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
*****FPCN 111176 UPDATE/LOCATION CHANGE*****Revision History:February 27, 2025: Issued initial notification.February 20, 2026: Issued final notification. Attached the Qualification Report. Provided the Estimated First Ship date to be on March 30, 2026. Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table.Description of Change:Qualification of HANA as an additional assembly site for selected MIC5233, MIC5239, MIC5209, MIC79050 and MIC5201 device families available in 3L SOT-223 package.Reason for Change:To improve on-time delivery performance by qualifying HANA as an additional assembly site.*Please see documents for additional changes
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
***UPDATE OF PCN111394***Description of Change: Qualification of MTAI as an additional final test location for selected MIC5233, MIC2920A, MIC2954, MIC5200, MIC5201, MIC5209, MIC79050, MIC39100, MIC37100, and MIC5239 device families available in 3L SOT-223 package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional final test location.Revision History:March 10, 2025: Issued initial notification.June 17, 2025: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on July 14, 2025. Updated affected CPN list to remove all Tape and Reel parts based on the updated scope. Updated the Pre and Post Change Summary Table and attached file.
***UPDATE OF PCN110834***Description of Change: CCB 7364.004 Final Notice: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected LM4040, LM4041, MIC23158, MIC23159, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC4043, MIC4680, MIC4681, MIC4682, MIC4684, MIC4685, MIC4690, MIC5201, MIC5203, MIC5205, MIC5206, MIC5207, MIC5208, MIC5209, MIC5210, MIC5211, MIC5212, MIC5213, MIC5216, MIC5219, MIC5234, MIC5236, MIC5237, MIC5238, MIC5239, MIC5270, MIC5271, MIC6211, MIC6270, MIC79050, MM5450 and MM5451 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change: Qualification of MTAI as an additional final test location for selected MIC5233, MIC2920A, MIC2954, MIC5200, MIC5201, MIC5209, MIC79050, MIC39100, MIC37100, and MIC5239 device families available in 3L SOT-223 package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional final test location.
Description of Change: Qualification of HANA as an additional assembly site for selected MIC5233, MIC5239, MIC5209, MIC79050 and MIC5201 device families available in 3L SOT-223 package.Reason for Change: To improve on-time delivery performance by qualifying HANA as an additional assembly site.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for MIC5207, MIC5209, MM5450, MM5451, MIC38C44, MIC38C45, MIC38C42, MIC38C43, MIC5233, MIC5205, MIC5235, MIC5219, MIC5225, MIC4684, MIC5239, MIC5236, MIC5234,MIC5238, MIC5210, MIC79050, MIC5212, MIC5201, MIC3490, MIC4685, MIC5295, MIC4680, and MIC5237 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Part Status:
The MIC5209-5.0YS is an efficient linear voltage regulator with very low dropout voltage, typically 10 mV at light loads and less than 500 mV at full load, with better than 1% output voltage accuracy.
Designed especially for hand-held, battery-powered devices, the MIC5209 features low ground current to help prolong battery life. An enable/shutdown pin on SO-8 and TO-263-5 versions can further improve battery life with near-zero shutdown current.
Key features include reversed-battery protection, current limiting, over temperature shutdown, ultra-low-noise capability (SO-8 and TO-263-5 versions), and availability in thermally efficient packaging. The MIC5209 is available in adjustable or fixed output voltages.
Features:
Applications:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.